C450EZ950-S44000-X Datasheet, PDF (1/6 Pages) Cree, Inc – Cree EZ950-p LEDs

Cree^® EZ950-p™ LEDs
Data Sheet (Anode-up)
CxxxEZ950-Sxxx00-x
Cree’s EZBright^® LEDs are the newest generation of solid-state LED emitters that combine highly efficient InGaN
materials with Cree’s proprietary optical design and device submount technology to deliver superior value for high-
intensity LEDs. The optical design maximizes light extraction efficiency and enables a Lambertian radiation pattern.
Additionally, these LEDs are die-attachable with conductive adhesive, solder paste or solder preforms, as well as flux
eutectic attach. These vertically structured, low forward voltage LED chips are approximately 170 microns in height
and are tested for conformity to optical and electrical specifications. Cree’s EZ™ chips are useful in a wide range of
applications including general illumination, automotive lighting and mobile flash.
FEATURES
• Lambertian Radiation Pattern
• Anode-up design (p-pad up)
• EZBright LED Technology, binned @ 350 mA
– 450 nm – 440+ mW
– 460 nm – 420+ mW
– 470 nm – 400+ mW
– 527 nm – 170+ mW
• Low Forward Voltage (Vf) – 3.1 V Typical at 350 mA
• Maximum DC Forward Current – 1000 mA
• Backside Metal versions for various attach methods:
-A (AuSn) for use with Conductive Adhesives, Flux
Eutectic Attach, Solder Paste & Solder Preforms
-G (LTDA) for Low Temperature Flux Eutectic Attach
APPLICATIONS
• General Illumination
– Aircraft
– Decorative Lighting
– Task Lighting
– Outdoor Illumination
• White LEDs
• Projection Displays
• Automotive Exterior
• Mobile Flash
CxxxEZ950-Sxxx00-x Chip Diagram
Top View
930 x 930 µm
Backside Ohmic
Metallization
Mesa (Junction), 900 x 900 µm
Bond pads (2), 130 x 130 µm
Anode (+), 2 places
Thickness 170 µm
Side View
Cathode (-)
Bottom View
Subject to change without notice.
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