C450DA2432-S3300-2 Datasheet, PDF (1/5 Pages) Cree, Inc – Cree Direct Attach DA2432 LEDs

Cree^® Direct Attach™ DA2432™ LEDs
CxxxDA2432-Sxxx00-2
Data Sheet
Cree’s Direct Attach™ DA2432™ LEDs are the next generation of solid-state LED emitters that combine highly efficient
InGaN materials with Cree’s proprietary device technology and silicon-carbide substrates to deliver superior value for
the LCD backlighting and general-illumination markets. The DA2432 LEDs are among the brightest in the top-view
market while delivering a low forward voltage, resulting in a very bright and highly efficient solution. The bondpad-
down design allows for eutectic die attach, eliminating the need for wire bonds, and enables superior performance
from improved thermal management. The design is optimally suited for industry-standard top-view packages.
FEATURES
APPLICATIONS
• Rectangular LED RF Performance
– 450 & 460 nm – 33 mW min
– 470 nm – 30 mW min
• High Reliability -Eutectic Attach
• Low Forward Voltage (Vf) – 3.1 V Typical at 20 mA
• Maximum DC Forward Current – 100 mA
• 1000-V ESD Threshold Rating
• InGaN Junction-Down Design
for Improved Thermal Management
• Direct Attach - No wire bonding
• Excellent Performance over Temperature
• General Illumination
– White LEDs
– Chip-on-Board (COB)
– Multi-chip Arrays
– High Voltage Arrays
• LCD Backlighting
– Television
– Monitors
– Portable PCs & Tablets
• LED Video Displays
CxxxDA2432-Sxxx00-2 Chip Diagram
240 x 320 µm
Anode (+)
170 x 60 µm
Gap 60 µm
Top View
Thickness
140 µm
Cathode (-)
145 x 105 µm
Side View
Subject to change without notice.
www.cree.com
Bottom View
1