C450DA1000-S48500-2-G Datasheet, PDF (1/6 Pages) Cree, Inc – Cree Direct Attach DA1000 LEDs

Cree^® Direct Attach™ DA1000™ LEDs
CxxxDA1000-Sxxx00-2-G
Data Sheet
Cree’s DA™ LEDs are the next generation of solid-state LED emitters that combine highly efficient InGaN materials with
Cree’s proprietary device technology and silicon-carbide substrates to deliver superior value for the general-illumination
market. The DA LEDs are among the brightest in the lighting market while delivering a low forward voltage, resulting
in a very bright and highly efficient solution. The bondpad-down configuration is designed for a flux eutectic die-attach
process, eliminating the need for wire bonds, and enables superior performance from improved thermal management.
FEATURES
• Direct Attach LED Technology
• Rectangular LED RF Performance
– 445-475 nm – 485+ mW
– 527 nm – 200+ mW
• High Reliability -Eutectic Attach
• Low Forward Voltage (Vf) – 3.15 V Typical at 350 mA
• Maximum DC Forward Current – 1000 mA
• Junction-Down for Improved Thermal Management
• No Wire Bonds Required
APPLICATIONS
• General Illumination
− Aircraft
− Decorative Lighting
− Task Lighting
− Outdoor Illumination
• White LEDs
• Camera Flash
• Projection Displays
• Automotive
CxxxDA1000-Sxxx00-2-G Chip Diagram
1000 x 1000 µm
Anode (+), 915 x 75 µm
Gap 70 µm
Cathode (-), 890 x 795 µm
Top View
Thickness, 335 µm
Side View
Subject to change without notice.
www.cree.com
Bottom View
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