CHS Datasheet, PDF (3/14 Pages) Copal Electronics – SLIDE SWITCHES (HALF PITCH)

CHS
SLIDE SWITCHES (HALF PITCH)
˙ STANDARD SPECIFICATIONS
Operating temp. range
Storage temp. range
− 40 ~ 85 °C
Sealing
Net weight
Washable type available with seal tape
Approx. 0.05 g (CHS-01) Approx. 0.08 g (CHS-02)
Approx. 0.12 g (CHS-04) Approx. 0.17 g (CHS-06)
Approx. 0.22 g (CHS-08) Approx. 0.25 g (CHS-10)
˙ ELECTRICAL CHARACTERISTICS
Contact rating
Non-switching
Switching
Minimum
DC50 V 100 mA
DC6 V, 100 mA DC24 V, 25 mA
DC20 mV 1 μA
Contact resistance
50 mΩ maximum
Insulation resistance
1000 MΩ (DC100 V) minimum
Dielectric strength
AC500 V, 60 s
˙ MECHANICAL CHARACTERISTICS
Operating force
Stop strength
Solderability
Soldering heat
Shear (Adhesion)
Substrate bending
Pull-off strength
0.5 ~ 5 N {0.05 ~ 0.51 kgf}
10 N {1.02 kgf}, 60 s
245 ± 3 °C, 2 ~ 3 s
Reflowɿ255 °C (Peak temperature)
ʢPlease refer to the profile belowʣ
Manual solderingɿ350 ± 10 °C, 3 ~ 4 s
5 N {0.51 kgf} 10 s
Width 90 mm, bend 3 mm, 5 s, 1 time
5 N {0.51 kgf} 10 s
{ } : Reference only
˙ ENVIRONMENTAL CHARACTERISTICS
Vibration
Shock
Load life
Humidity
High temp. exposure
Amplitude 1.5 mm or
Acceleration 98 m/s²,
10-500 Hz, 3 directions for 10 cycles each
490 m/s², 11 ms
6 directions for 3 times each
Continuous load 2000 cycles,
DC6 ± 0.5 V, 100 ± 10 mA
−10 ~ 65 °C,
Relative humidity 0 ~ 96 %,
24 h for 10 cycles
85 °C, 96 h
Low temp. exposure
− 40 °C, 96 h
Thermal shock
− 40 (0.5 h) ~ 85 °C (0.5 h), 5 cycles
ʪReflow profile for soldering heat evaluationʫ
(C)
250
200
180 C
150 150 C
100
50
Peak
:
250
+5
0
C
Over 230 C
Pre Heating Zone
90 30 s
30 10 s
Heating time ^{Soldering Zone}
Ϧϑϩʔճ਺ɿ̎ճɹReflow : two times maximum