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FP1308R1-R11-R Datasheet, PDF (1/4 Pages) Cooper Bussmann, Inc. – High Current, High Frequency, Power Inductors
High Current, High Frequency, Power Inductors
FLAT-PAC™ FP1308R Series
SMD Device
Description
• Halogen Free
• 125°C maximum total temperature operation
• 12.70 x 13.46 x 8.0mm surface mount package
• Ferrite core material
• High current carrying capacity, Low core losses
• Controlled DCR tolerance for sensing circuits
• Inductance range from 110nH to 440nH
• Current range from 37 to 120 Amps
• Frequency range up to 2MHz
• RoHS compliant
Applications
• Multi-phase regulators
• Voltage Regulator Module (VRM)
• Desktop and server VRMs and EVRDs
• Data networking and storage systems
• Notebook regulators
• Graphics cards and battery power systems
• Point-of-load modules
• DCR sensing
HALOGEN
HF
FREE
Environmental Data
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(with derated current)
• Solder reflow temperature: J-STD-020D compliant
Packaging
• Supplied in tape and reel packaging, 400 parts per reel,
13” diameter reel
Part
OCL1
FLL2
Number7
± 10% (nH)
(nH)
R1 Version
FP1308R1-R11-R
110
79
FP1308R1-R21-R
210
152
FP1308R1-R26-R
260
187
FP1308R1-R32-R
320
230
FP1308R1-R44-R
440
317
R2 Version
FP1308R2-R11-R
110
79
FP1308R2-R21-R
210
152
FP1308R2-R26-R
260
187
FP1308R2-R32-R
320
230
FP1308R2-R44-R
440
317
R3 Version
FP1308R3-R11-R
110
79
FP1308R3-R21-R
210
152
FP1308R3-R26-R
260
187
FP1308R3-R32-R
320
230
FP1308R3-R44-R
440
317
Product Specifications
Irms3
Isat14
(Amps)
@ 25°C (Amps)
120
80
57
64
52
37
120
80
45
64
52
37
120
80
68
64
52
37
Isat25
@ 125°C (Amps)
105
68
52
40
28
105
68
52
40
28
105
68
52
40
28
DCR (mΩ)
@ 20°C
0.32 ± 9.4%
0.53 ± 10%
0.18 ± 20%
K-factor6
233
233
233
233
233
233
233
233
233
233
233
233
233
233
233
1 Open Circuit Inductance (OCL) Test Parameters: 100kHz, 0.10Vrms, 0.0Adc
2 Full Load Inductance (FLL) Test Parameters: 100kHz, 0.1Vrms, Isat1.
3 Irms: DC current for an approximate temperature rise of 40°C without core loss. Derating is
necessary for AC currents. PCB pad layout, trace thickness and width, air-flow and proximity of
other heat generating components will affect the temperature rise. It is recommended the part
temperature not exceed 125°C under worst case operating conditions verified in the end
application.
4 Isat: Peak current for approximately 20% rolloff at +25°C.
5 Isat2: Peak current for approximately 20% rolloff at +125°C.
6 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ΔI * 10-3. Bp-p (Gauss),
K: (K-factor from table), L: (inductance in nH), ΔI (peak-to-peak ripple current in amps).
7 Part Number Definition: FP1308Rx-Rxx-R
• FP1308 = Product code and size
• Rx = DCR indicator
• Rxx = Inductance value in μH, R = decimal point.
• “-R” suffix = RoHS compliant
0209 BU-SB08890
Page 1 of 4
Data Sheet: 4355