41206ESDA-TR1 Datasheet, PDF (1/4 Pages) Cooper Bussmann, Inc. – The best ESD protection for high frequency, low voltage applications

41206ESDA, Four Element
Array Chip, Polymer ESD
Suppressor With SurgX^® Technology
Features:
• The best ESD protection for high frequency, low voltage applications.
• Protects up to 4 separate lines with one device
• Exceeds testing requirements outlined in IEC 61000-4-2
• Extremely low capacitance
• Very low leakage current
• Fast response time
• Bi-directional
• Surface mount
• Solder Termination
• RoHS Compliant
Description:
The ESDA product family with SurgX^® Technology is
specifically designed to protect sensitive electronic circuits
from the threat of electrostatic discharge (ESD). 4-line array
can protect up to 4 isolated lines simultaneously with perfor-
mance similar to individual chip devices. ESDA devices react
almost instantaneously to the transient voltage and effectively
clamp it in an average of 35V for the duration of the ESD tran-
sient, meaning less voltage stress during the clamp period and
greater IC protection. The design of ESDA series inherently
produces an ultra low capacitance part. In the off state the
product is virtually invisible to the circuit. Installed from signal
line to ground, it is especially transparent to the high-speed
digital circuits due to the high off-state impedance and low
capacitance. Signals are not distorted or disrupted as shown
by extensive testing. With ESDA series, waveform definition
stays true and high-speed signals do not suffer. ESDA series
utilize a unique polymer-based material. The nature of the
material creates a bi-directional part, which means that only
one device is required to provide complete ESD protection
regardless of the surge polarity. The combination of this mate-
rial with proven thick film on ceramic technology produces a
reliable, surface mount product that will help protect mobile
communications, computers, data processing, test equipment,
and many other electronic applications from ESD.
Part Ratings and Characteristics:
Performance Characteristics Units Min
Continuous operating voltage
VDC
-
Clamping voltage³
V
-
Trigger voltage⁴
V
ESD Threat voltage capability⁵
kV
-
Capacitance (@ 1 KHz ~ 1.8GHz) pF
-
Leakage current (@ 12 VDC)
nA
0.01
Peak current³
A
-
Operating temperature
°C
-40
ESD pulse withstand ³
# pulses 20
Typ
12¹
35
150
8
0.15
<0.1
30
+25
>500²
Max
-
60
300
15
1
45
+105
-
Notes:
1. The product is 100% tested for 30V operating voltage at 25°C.
Continuous operation with higher than 12VDC under extreme
temperature and humidity may cause increasing leakage cur-
rent and/or shifting device resistance. However, even under
severe environmental test, characteristics of the device did not
change up to 12VDC operation.
2. Some shifting in characteristics may occur when tested over
several hundred ESD pulses at very rapid rate of 1 pulse per
second or faster.
3. Per IEC 61000-4-2, 30A @ 8kV, level 4, clamp measurement
made 30 ns after initiation of pulse, all tests in contact dis-
charge mode.
4. Trigger measurement made using Transmission Line Pulse
(TLP) method.
5. PolySurg™ devices are capable of withstanding up to a 15 kV,
45A ESD pulse. Device ratings are given at 8kV per Note 1,
unless otherwise specified.
Environmental Specifications:
• Moisture Resistance: MIL-STD-883, Method 1004.7, 85°C, 85%R.H., 240 hrs.
• Thermal shock: MIL-STD-202, Method 107G, -65°C to 125°C, 30 min. cycle, 5 cycles
• Vibration: MIL-STD-202F, Method 201A,(10 to 55 to 10 Hz, 1 min. cycle, 2 hrs each in X-Y-Z)
• Chemical resistance: ASTM D-543, 24 hrs @ 50°C, 3 solutions (H2O, detergent solution, defluxer)
• Full load voltage: Up to 24 VDC, 1000 hrs, 25°C
• Solder leach resistance and terminal adhesion: Per EIA-576
• Solderability: MIL-STD-202, Method 208 (95% coverage)