OH300 Datasheet, PDF (4/6 Pages) Connor-Winfield Corporation – Oven Stabilized Oscillator

2111 Comprehensive Drive
Aurora, Illinois 60505
Phone: [phone]
Fax: [phone]
www.conwin.com
Environmental Characteristics
Shock
100 G's 3ms, Halfsine, 3 shocks per direction, per MIL-STD 202G, Method 213B Test Condition D.
Sinusoidal Vibration
Random Vibration
0.06” D.A. or 10G’s Peak, 10 to 500 Hz, per MIL-STD-202G, Method 204D, Test Condition A.
5.35 G’s rms. 20 to 2000 Hz per MIL-STD-202G, Method 214,Test Condition 1A, 15 minutes each axis.
Altitude
70,000 ft max
Moisture
10 cycles, 95% RH, Per MIL-STD-202G, Method 112.
Marking Permanency
Per MIL-STD-202G, Method 215J.
Solder Process Recommendations: RoHS compliant, lead free. See solder profile on page 6.
In-line reflow:
Refer to recommended reflow pre-heat and reflow temperatures on page 6. Package material


consist of Ryton R-4 high temperature cover with FR4 substrate. Component solder is Pb free
high temperature eutectic alloy with a melting point of 221°C.|
In-line oven profile:

We recommend using KIC profiler or similar device placing one of the thermocouples on the
device to insure that the internal package temperature does not exceed 221°C.
Removal of device:
If for any reason the device needs to be removed from the board, use a temperature controlled

repair station with profile monitoring capabilities. Following a monitored profile will insure the

device is properly pre-heated prior to relow. Refer to IPC 610E for inspection guidelines.
Recommended Cleaning Process: (If required)

Device is non-hermetic, water resistance with four weep holes, one in each corner to allow


moisture to be removed during the drying cycle. We recommend in-line warm water wash
with air knife and drying capabilities. If cleaner does not have drying capability, then use hot air


circulated oven. Boards should be placed in the oven vertically for good water runoff
Device must be dried properly prior to use!
Note: If saponifier is used make sure the device is rinsed properly to insure all residues are removed. PH of saponifier should
not exceed 10.
Drying Temperature:
Between 85 to 100°C.
Drying Time:
Time will vary depending on the board size.
Caution: Do not submerge the device!
Package Outline
Suggested Pad Layout
0.866+/-0.008
(22.00+/-0.20mm)
0.300
(7.62mm)
0.200
(5.08mm)
0.200
0.300
(5.08mm) (7.62mm)
0.150
(3.81mm)
0.200
(5.08mm)
(3.01.7152m5m)Typ.
I⁽ W
1238
OH300-61003CF
38.88 MHZ
0123456789012
0123456789012
1.000+/-0.008
(25.40+/-0.20mm)
(Bottom View)
0.120 Typ.
(3.048mm)
(Top View)
0.905
(22.99mm)
Pin 1
0.350
(8.89mm)
0.700
Typical Pad Size
0.100 x 0.100
(17.78mm)
(2.54 x 2.54mm)
0.062 0.500
7 Places
(1.57mm) (12.70mm) Max. _{Dimensional Tolerance}
+/-0.005 (0.127mm)
Pad Termination Finish: Gold Flash <10 micro inches
0.350
(8.89mm)
0.350
(8.89mm)
Keep Out
Area
* Do not route any traces in the keep out area. It is recommended
the next layer under the keep out area is to be ground plane.
Marking Information
Pad Connections
I^{( W}
1238
OH300-61003CF
38.88 MHZ
0123456789012
0123456789012
Date Code (YYWW)
Model Number
Output Frequency
Serial # Barcode
Serial Number
1: Voltage Control or N/C
2: N/C
3: Supply Voltage (Vcc)
4: RF Output
5: Do Not Connect
6: Do Not Connect
7: Ground (Case)
Pin 1
DO NOT connect "DNC" pads to ground
or supply rails.
Attention: System Designers please review Application Note AN2093:
System Design Information and Printed Circuit Board Layout Guidelines for OCXO Oscillators.
@ www.conwin.com/support.html
Specifications subject to change without notification. See Connor-Winfield's website for latest revision. All dimensions in inches.
© Copyright 2015 The Connor-Winfield Corporation Not intended for life support applications.
Bulletin
Page
Revision
Date
Cx210
4 of 6
15
06 March 2015