M100V-010M Datasheet, PDF (3/4 Pages) Connor-Winfield Corporation – High Precision TCXO / VCTCXO Oscillators

2111 Comprehensive Drive
Aurora, Illinois 60505
Phone: [phone]
Fax: [phone]
www.conwin.com
Package
Package Characteristics
Hermetically sealed ceramic package with grounded metal cover
Vibration:
Shock:
Soldering Process:
Environmental Characteristics
Vibration per Mil Std 883E Method 2007.3 Test Condition A.
Mechanical Shock per Mil Std 883E Method 2002.4 Test Condition B.
RoHS compliant lead free. See soldering profile on page 2.
Notes:
1. Initial calibration @ 25°C. ±2°C, for VCTCXO's Vc = 1.65V. Specifications at time of shipment after 48 hours of operation.
2. Frequency stability vs. change in temperature. [±(Fmax-Fmin)/2.Fo]. For VCTCXO's - Vc -= 1.65V
3. Frequency change after reciprocal temperature ramped over the operating range. Frequency measured before and after at 25°C
4. Two consecutive reflows after 1 hour recovery @ 25°C.
5. Frequency drift over 1 year @ 25°C.
6. BW = 12 KHz to Fo/2
7. Attention: To achieve optimal frequency stability, and in some cases to meet the specification stated on this data sheet, it is required that the
circuit connected to this TCXO output must have the equivalent input capacitance that is specified by the nominal load capacitance. Deviations
from the nominal load capacitance will have a graduated effect on the stability of approximately 20 ppb per pF load difference.
M100 - M200
Package Outline
0.126
(3.2mm)
0.083 Max.
(2.1mm)
0.006 Typ.
(0.15mm)
0.016
(0.41mm)
0.065
(1.65mm) 0.028
(0.71mm)
0.042
(1.07mm)
0.197
(5.0mm)
0.050
(1.27mm)
Top
View
Pad 1
Dimensional Tolerance:
+/-0.005 (+/-0.127mm)
0.008 Typ.
(0.20mm)
Bottom
View
0.028
(0.71mm)
Pad 8
0.042
(1.07mm)
M100 - M200
Suggested Pad Layout
To
Output
0.028
(0.71mm)
Keep
5
Out
Area*
0.053
4
(1.35mm)
External
Bypass
Capacitor
0.1 uF
&
10 nF
Top
View
0.098
(2.49mm)
8
1
0.050
(1.27mm)
To
Ground
0.050
(1.27mm)
M100 - M200
Pad Connections
1: VCTCXO: Control Voltage (Vc)
TCXO: N/C
2: Do Not Connect
3: Do Not Connect
4: Ground
5: Output
6: Do Not Connect
7: Do Not Connect
8: Supply Voltage (Vcc)
Alternate Package Layout
for Select Frequencies
* Do not route any traces in the keep out area. It is
recommended the next layer under the keep out
area is to be ground plane.
0.126
(3.2mm)
0.197
(5.0mm)
0.098
(2.5mm)
0.006Typ.
(0.15mm)
0.016
(0.41mm)
0.065
(1.65mm)
0.028
(0.71mm)
0.042
(1.07mm)
0.050
(1.27mm)
Pad 1
0.008 Typ.
(0.20mm)
Bottom
View
0.028
(0.71mm)
Pad 8
0.042
(1.07mm)
M100 - M200 Test Circuit
M100 - M200 Design Recommendations
Vcc, should have
a large copper
area for reduced
inductance.
Connect a 0.01uF
bypass capacitor
<0.1”(2.54mm)
from the pad.
8
9
0.010”(0.254mm)
Recommended
clearance
inductance
for internal
76
5₅
copper flood.
Vcc
10
4
1
23
4
Ground,
Top View
should have
a large copper
area for reduced
inductance.
Ground
M100F 1145
10.0 MHZ
Top View
50 Ohm trace
<1”by design
Buffer
Ground
Vcc
Supply
Voltage
DNC DNC
8
76
5
Output
OSC
TOP LAYER
GROUND LAYER
50 Ohm Trace
Without _Output
Vias _Buffer
0.1 uF
Bypass
10 nF
Bypass
1
4
23
15 pF
BOTTOM LAYER
TCXO = N/C
VCTCXO = Vc
DNC DNC
DNC = Do Not Connect
Specifications subject to change without notification. See Connor-Winfield's website for latest revision. All dimensions in inches.
© Copyright 2015 The Connor-Winfield Corporation Not intended for life support applications.
Bulletin
Page
Revision
Date
Tx382
3 of 4
02
25 March 2015