AL181 Datasheet, PDF (1/2 Pages) Connor-Winfield Corporation – 3.3V SURFACE MOUNT 9x14mm Clipped Sinewave OCVCXO

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Aurora, Illinois 60505
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630-851-4722:
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Bulletin
Page
Revision
Date
Cx161
1 of 2
P00
07 Oct 2008
3.3V SURFACE MOUNT
9x14mm Clipped Sinewave
OCVCXO
Description
Features
Connor-Winfield model AL181 is a 3.3V
Clipped Sinewave, Oven Controlled,
Voltage Controlled Crystal Oscillator
(OCVCXO) in a 9x14mm surface mount
package. The AL181 is low cost, high
performance SMT OCVCXO.
Patent Pending
Specifications
Absolute Maximum Ratings
Parameter
Storage Temperature
Supply Voltage
Units
(Vcc)
Minimum
-55
-0.5
Model: AL181
OCVCXO
3.3V Operation
Frequency Stability: +/-95ppb
Temperature Range: -5 to 70°C
Clipped Sinewave Output
Tape and Reel Packaging
RoHS Compliant, Lead Free
Nominal
-
-
Maximum
85
4.5
Units
°C
Vdc
Note
Operating Specifications
Parameter
Center Frequency
Frequency Calibration @ 25°C
Frequency Stability vs. Change in Temperature
Frequency Stability vs. Change in Voltage
Frequency Stability vs. Change in Load
Aging 1^st Year
Operating Temperature Range
Supply Voltage
Supply Current
Start-Up Time
(Fo)
(Vcc)
Minimum
-
-1.0
-95
-30
-30
-1.5
-5
3.133
-
Nominal
19.2
-
-
-
-
-
3.30
-
Maximum
-
1.0
95
30
30
1.5
70
3.465
400
10
Units
MHz
ppm
ppb
ppb
ppb
ppm
°C
Vdc
mA
ms
Note
(+/-5%)
(+/-5%)
(+/-5%)
Input Characteristics for Control Voltage
Parameter
Control Voltage
Tuning Frequency
Linearity
Slope
Input Impedance
Minimum
0.0
+/-5
-
2.5
50K
Nominal
-
-
-
-
-
Maximum
3.0
+/-20
10
15
-
Units
V
ppm
%
ppm/V
Ohms
Note
Positive
Clipped Sinewave Output Characteristics
Parameter
Load
Output Voltage
Period Jitter
Phase Jitter (BW=12kHz to 20MHz)
SSB Phase Noise at 10Hz offset
SSB Phase Noise at 100Hz offset
SSB Phase Noise at 1KHz offset
SSB Phase Noise at 10KHz offset
Minimum Nominal Maximum
10KOhm//10pF
1.00
-
-
-
3
5
-
0.5
1
-
-
-80
-
-
-110
-
-
-130
-
-
-145
Units
Note
V pk-pk
ps rms
ps rms
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
AC Coupled
Package Characteristics
Package
Environmental Characteristics
Vibration:
Shock:
Soldering:
Solderability
Package Outline
0.355
(9.02mm)
Non-hermetic package consisting of an FR4 substrate and cover.
Vibration per Mil Std 883E Method 2007.3 Test Condition A
Mechanical Shock per Mil Std 883E Method 2002.4 Test Condition B.
RoHS compliant, lead free. See solder profile.
Solderability per Mil Std 883E Method 2003
0.295 Max.
(7.49mm)
0.060
(1.52mm)
0.555
(14.1mm)
0.275
(6.99mm)
0.040
(1.02mm)
0.100
(2.54mm)
0.100
(2.54mm)
0.025
(0.64mm)
Dimensional Tolerance: ±.005 (.127mm)
Specifications subject to change without notice. All dimensions in inches. © Copyright 2008 The Connor-Winfield Corporation