GBJ2502-G Datasheet, PDF (1/2 Pages) Comchip Technology – Glass Passivated SINGLE PHASE BRIDGE Rectifier

Glass Passivated Single Phase Bridge Rectifiers
GBJ2502-G Thru. GBJ2508-G
Reverse Voltage: 200 to 800V
RoHS Device
COMCHIP
SMD Diodes Specialist
Features
-Plastic package has underwriters laboratory
Flammability classification 94V-0.
-Glass passivated chip junction.
-High case dielectric with standing voltage of
2500 VRMS.
-High surge current capability.
-Ideal for printed circuit boards.
-High temperautre soldering guaranteed:
260^OC/10sec, 0.375"(9.5mm) lead length,
5lbs.(2.3kg) tension.
Mechanical Data
-Case: 5S Molded Plastic body
-Terminal: Plated leads solderable per MIL-STD-
750, method 2026.
-Mounting position : Any (Note 3).
-Mounting torque: 8 in-lbs max.
-Weight: 0.26 ounce, 7.0 grams.
GBJ
30 ± 0.3
+
2.5 ± 0.2
2.2± 0.2
1±0.1
7.5 7.5
10±0.2 ±0.2 ^±0.2
4.6± 0.2
3.6± 0.2
0.7± 0.1
2.7± 0.2
Dimensions in millimeter
Maximum ratings and electrical characteristics
Rating at 25^OC ambient temperature unless otherwise specified.
Parameter
Symbol GBJ2502-G
GBJ2504-G
GBJ2506-G
Maximum repetitive peak reverse voltage
VRRM
200
Maximum RMS voltage
VRMS
140
Maximum DC blocking voltage
VDC
200
Maximum average forward
output current
@TC=107^OC
@TA=25^OC
I ( AV)
Peak forward surge current, 8.3ms single
half sine-wave superimposed on rated load
IFSM
(JEDEC method)
Maximum instantaneous forward voltage
VF
drop per element at 12.5A DC
Maximum reverse current at
TA=25^OC
IR
rated DC blocking voltage
TA=125^OC
Typical thermal resistance
RθJA
Operating and storage temperature range TJ,TSTG
400
600
280
420
400
600
25
3.5
350
1.05
10
350
22
-55 ~ +150
Note:
1. Unit case mounted on Al plate heatsink.
2. Unit mounted on P.C.B. with 0.5×0.5" ( 12×12mm) copper pads and 0.375"(9.5mm) lead length.
3. Recommended mounting position is to bolt down on heatsink with silicon thermal compound for maximum heat transfer with #6 screws.
GBJ2508-G
800
560
800
Unit
V
V
V
A
A
V
μA
O_C/W
O_C
QW-BBR09
REV:A
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