GBJ25005-G Datasheet, PDF (1/4 Pages) Comchip Technology – Glass Passivated Bridge Rectifiers

Glass Passivated Bridge Rectifiers
GBJ25005-G Thru. GBJ2510-G
Reverse Voltage: 50 to 1000V
Forward Current: 25.0A
RoHS Device
Comchip
SMD Diode Specialist
Features
- Rating to 1000V PRV.
-Ideal for printed circuit board
-Low forward voltage drop, high current capability.
GBJ
Φ0.134(3.4)
Φ0.122(3.1)
0.118(3.00)*45°
1.193(30.3)
1.169(29.7)
0.189(4.8)
0.173(4.4)
0.150(3.8)
0.134(3.4)
Mechanical Data
-Epoxy: U/L 94-V0 rate flame retardant.
-Case: Molded plastic, GBJ
-Mounting position: Any
-Weight: 6.81grams
+
0.106(2.7)
0.096(2.3)
0.094(2.4)
0.078(2.0)
0.043(1.1)
0.035(0.9)
~~_
0.402(10.2) 0.303(7.7) 0.303(7.7)
0.386(9.8) 0.287(7.3) 0.287(7.3) ^SPACING
0.114(2.9)
0.098(2.5)
0.031(0.8)
0.023(0.6)
Dimensions in inches and (millimeter)
Maximum ratings and electrical characteristics
Rating at 25 ^OC ambient temperature unless otherwise specified.
Single phase, half wave ,60Hz, resistive or inductive load.
For capacitive load, derate current by 20%
Parameter
GBJ
Symbol
GBJ
GBJ
GBJ
GBJ
25005-G 2501-G 2502-G 2504-G 2506-G
Maximum Recurrent Peak Reverse Voltage
VRRM
50
100
200
400
600
Maximum RMS Voltage
VRMS
35
70
140
280
420
Maximum DC Blocking Voltage
VDC
50
Maximum Average Forward (With heatsink Note2)
I(AV)
Rectified Current @Tc=100°C (without hestsink)
Peak Forward Surage Current ,
8.3ms Single Half Sine-Wave
IFSM
Super Imposed On Rated Load (JEDEC Method)
100
200
400
600
25.0
4.2
350
Maximum Forward Voltage at 12.5A DC
VF
1.1
Maximum DC Reverse Current
At Rate DC Blocking Voltage
2
I T Rating for Fusing(t<8.3ms)
@TJ=25°C
@TJ=125°C
Typical Junction Capacitandce Per Element
(Note 1)
Typical Thermal Resistance (Note 2)
IR
2
It
CJ
RθJA
10.0
500
510
85
0.6
Operating Temperature Range
TJ
Storage Temperature Range
TSTG
-55 to +150
-55 to +150
GBJ
2508-G
800
560
800
GBJ
2510-G
1000
700
1000
Unit
V
V
V
A
A
V
μA
2
As
pF
O_C/W
O_C
O_C
Notes:
1. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
2. Device mounted on 300mm*300mm*1.6mm Cu plate heatsink.
QW-BBR60
Comchip Technology CO., LTD.
REV:C
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