CZRM27C3V6P Datasheet, PDF (1/3 Pages) Comchip Technology – Surface Mount Zener Diode

Surface Mount Zener Diode
CZRM27C3V6P THRU C200P
COMCHIP
www.comchiptech.com
Features
‘ Low profile surface-mount package
‘ Zener and surge current specification
‘ Low leakage current
‘ Excellent stability
Power Dissipation 0.8Watts
MINI-SMA
0.161(4.1)
0.146(3.7)
0.012(0.3)Typ.
Mechanical Data
‘ Case: Molded plastic MINI-SMA
‘ Epoxy: UL 94V-0 rate flame retardant
‘ Solderable per MIL-STD-202,
method 208 guaranteed
‘ Polarity: cathode band
‘ Mounting position: Any
‘ Weight: 0.04gram(approx.)
0.035(0.9)Typ.
0.110(2.8)
0.094(2.4)
0.071(1.8)
0.055(1.4)
0.063(1.6)
0.055(1.4)
0.035(0.9)Typ.
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25^oC ambient temperature unless otherwise specified.
Parameter
VALUE
Units
Forward voltage
IF=0.2A
1.2
V
Power Dissipation
TA=25^oC ( Note )
0.8
TL=80^oC
2.3
W
Non-repetitive peak pulse
TJ=25^oC
300
W
power dissipation
100us square pulse
Non-repetitive peak pulse
TJ=25^oC
power dissipation
10/1000us waveform
150
W
(CZRM27C7V5P to C100P)
Non-repetitive peak pulse
TJ=25^oC
power dissipation
10/1000us waveform
100
W
(CZRM27C110P to C200P)
Thermal resistance junction to lead
30
ambient ( Note )
180
KW
Operating junction and Storage Temperature
Range
150 / -55 to +150
o_C
NOTES : Mounted on epoxy-glass PCB with 3 x 3 mm Cu pads ( 40um thick)
MDS0310010B
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