CURC301-G_12 Datasheet, PDF (1/4 Pages) Comchip Technology – SMD Ultra Fast Recovery Rectifiers

SMD Ultra Fast Recovery Rectifiers
CURC301-G Thru. CURC307-G
Reverse Voltage: 50 to 1000 Volts
Forward Current: 3.0 Amp
RoHS Device
Features
-Ideal for surface mount applications.
-Easy pick and place.
-Plastic package has Underwriters Lab.
flammability classification 94V-0.
-Fast recovery time: 50~75nS.
-Low leakage current.
DO-214AB (SMC)
0.126(3.20)
0.114(2.90)
0.280(7.11)
0.260(6.60)
0.245(6.22)
0.220(5.59)
Mechanical data
-Case: JEDEC DO-214AB, molded plastic.
-Terminals: solderable per MIL-STD-750,
method 2026.
-Polarity: Color band denotes cathode end.
-Approx. weight: 0.21 grams
0.103(2.62)
0.079(2.06)
0.060(1.52)
0.030(0.76)
0.320(8.13)
0.305(7.75)
0.012(0.305)
0.006(0.152)
0.008(0.203)Max
Dimensions in inches and (millimeter)
Maximum Ratings and Electrical Characteristics
Parameter
Symbol ^{CURC CURC CURC CURC}
301-G 302-G 303-G 304-G
Max. repetitive peak reverse voltage
VRRM
50
100
200
400
CURC
305-G
600
CURC
306-G
800
CURC _Units
307-G
1000 V
Max. DC blocking voltage
VDC
50
100
200
400
600
800
1000
V
Max. RMS voltage
VRMS
35
70
140
280
420
560
700
V
Peak surge forward current, 8.3ms
single half sine-wave superimposed
IFSM
on rate load (JEDEC method)
100
A
Max. average forward current
IO
3.0
A
Max. instantaneous forward voltage at
VF
1.0
1.3
1.7
V
3.0A
Reverse recovery time
Trr
50
75
nS
Max. DC reverse current at TA=25 ^OC
IR
rated DC blocking voltage TA=125 ^OC
Max. thermal resistance (Note 1)
RθJL
5.0
μA
150
20
O_C/W
Max. operating junction temperature
TJ
150
O_C
Storage temperature
TSTG
-55 to +150
O_C
Notes: 1. Thermal resistance from junction to lead mounted on P.C.B. with 8.0×8.0 mm square² land area.
QW-BU004
Comchip Technology CO., LTD.
REV:B
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