CURA101-G_12 Datasheet, PDF (1/2 Pages) Comchip Technology – SMD Ultra Fast Recovery Rectifiers

SMD Ultra Fast Recovery Rectifiers
CURA101-G Thru. CURA107-G
Reverse Voltage: 50 to 1000 Volts
Forward Current: 1.0 Amp
RoHS Device
Features
-Ideal for surface mount applications.
-Easy pick and place.
-Plastic package has Underwriters Lab.
flammability classification 94V-0.
-Ultra fast recovery time: 50~75nS.
-Low leakage current.
DO-214AC (SMA)
0.067(1.70)
0.051(1.29)
0.180(4.57)
0.160(4.06)
0.110(2.79)
0.086(2.18)
Mechanical data
-Case: JEDEC DO-214AC, molded plastic.
-Terminals: solderable per MIL-STD-750,
method 2026.
-Polarity: Color band denotes cathode end.
-Approx. weight: 0.063 grams
0.091(2.31)
0.067(1.70)
0.059(1.50)
0.035(0.89)
0.209(5.31)
0.185(4.70)
0.012(0.31)
0.006(0.15)
0.008(0.20)
0.004(0.10)
Dimensions in inches and (millimeter)
Maximum Ratings and Electrical Characteristics
Parameter
Symbol ^{CURA CURA CURA CURA}
101-G 102-G 103-G 104-G
Max. repetitive peak reverse voltage
VRRM
50
100
200
400
CURA
105-G
600
CURA
106-G
800
CURA _Units
107-G
1000 V
Max. DC blocking voltage
VDC
50
100
200
400
600
800
1000
V
Max. RMS voltage
VRMS
35
70
140
280
420
560
700
V
Peak surge forward current, 8.3ms
single half sine-wave superimposed
IFSM
on rate load (JEDEC method)
30
A
Max. average forward current
IO
1.0
A
Max. instantaneous forward voltage at
VF
1.0
1.3
1.7
V
1.0A
Reverse recovery time
Trr
50
75
nS
Max. DC reverse current at TA=25 ^OC
IR
rated DC blocking voltage TA=100 ^OC
Max. thermal resistance (Note 1)
RθJL
5.0
μA
100
42
O_C/W
Max. operating junction temperature
TJ
150
O_C
Storage temperature
TSTG
-55 to +150
O_C
Notes: 1. Thermal resistance from junction to lead.
QW-BU001
Comchip Technology CO., LTD.
REV:A
Page 1