CGRHD101-G Datasheet, PDF (1/4 Pages) Comchip Technology – Low Profile SMD Bridge Rectifiers

Low Profile SMD Bridge Rectifiers
Comchip
SMD Diode Specialist
CGRHD101-G Thru. CGRHD107-G
Reverse Voltage: 50 to 1000 Volts
Forward Current: 1.0 A
RoHS Device
Features
- Surge overload ratings to 35 amperes peak.
-1.0A rating in low profile surface mount min-dip
bridge save space on printed circuit board.
- Ideal for automated replacement.
- Glass passivated chip junctions.
- UL recognized file # E321971
Mechanical data
-Epoxy: UL94-V0 rate flame retardant.
-Case: Molded plastic low profile SMD mini-dip(MDLS),
Bridge case
-Terminals: solderable per MIL-STD-750,method 2026.
-Polarity: Marking on body.
-Mounting Position: Any
-weight: 0.10 grams (approx.).
0.035 (0.90)
0.019 (0.50)
~
0.228(5.80)
0.213(5.40)
+
0.106 (2.70)
0.090 (2.30)
MDLS
~
0.063(1.60)
0.055(1.40)
0.004(0.10)
max.
-
0.043(1.10)
0.020(0.50)
0.012(0.30)
0.004(0.10)
0.284(7.20)
0.260(6.60)
0.197(5.00)
0.181(4.60)
Dimensions in inches and (millimeter)
Maximum Rating And Electrical Characteristics
Rating at TA=25°C, unless otherwise noted.
Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Parameter
CGRHD CGRHD CGRHD CGRHD CGRHD CGRHD CGRHD
Symbol
Unit
101-G 102-G 103-G 104-G 105-G 106-G 107-G
Maximum Repetitive Peak Reverse Voltage
VRRM
50
100
200
400
600
800
1000
V
Maximum RMS Voltage
VRMS
35
70
140
280
420
560
700
V
Maximum Continuous Reverse Voltage
VR
50
100
200
400
600
800
1000
V
Maximum Forward Rectified Current
I(AV)
Peak Forward Surge Current
8.3mS single half sine-wave, superimposed on
IFSM
rate load(JEDEC Method)
at IF=0.5A
Maximum Forward Voltage
at IF=1.0A
@VR=VRRM TJ=25°C
Maximum Reverse Current
@VR=VRRM TJ=100°C
Junction to ambient,note 1
Typical Thermal Resistance
Junction to lead
Typical Junction Capacitance (Per leg, note 2)
Operating Temperature Range
VF
VF
IR
IR
RθJA
RθJL
CJ
TJ
Storage Temperature Range
TSTG
1.0
35
1.0
1.1
5.0
150
62.5
25.0
25
-55 to +150
-65 to +175
A
A
V
μA
°C/W
pF
°C
°C
Notes: 1. Thermal resistance from Junction to Ambient and from junctionto lead mounted on glass epoxy P.C.B 0.8*0.8(20*20mm) copper pad.
2. Measure at 1.0 MHZ and applied reverse voltage of 4.0 votls.
QW-BBR77
Comchip Technology CO., LTD.
REV:B
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