CDST914 Datasheet, PDF (1/2 Pages) Comchip Technology – Surface Mount Switching Diode

Surface Mount Switching Diode
COMCHIP
www.comchip.com.tw
CDST 914
Voltage: 100 Volts
Current: 200mA
Features
Fast Switching Speed
Surface Mount Package Ideally Suite4d for
Automatic Insertion
For General Purpose Switching Applications
High Conductance
.119 (3.0)
.110 (2.8)
.020 (0.5)
3
SOT-23
Top View
Mechanical Data
Case: SOT -23, Plastic
Terminals : Solderable per NIL-STD -202,
Method 208
Approx. Weight: 0.008 gram
3
CATHODE
1
ANODE
1
2
.037(0.95) .037(0.95)
.020 (0.5) .020 (0.5)
.103 (2.6)
.086 (2.2)
Dimensions in inches (millimeters)
Maximum Ratings
Continuous Reverse Voltage
Peak Forward Current
Peak Forward Surge Current
Rating
Thermal Characteristics
Characteristic
Total Device Dissipation FR– 5 Board(1)
T_A = 25°C
Derate above 25°C
Thermal Resistance, Junction to Ambient
Total Device Dissipation Alumina Substrate,(2) T_A = 25°C
Derate above 25°C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature
Electrical Characterics (TA = 25°C unless otherwise noted)
Characteristic (OFF CHARACTERISTICS)
Reverse Breakdown Voltage ( I_(BR) = 100 uAdc )
Reverse Voltage Leakage Current
V _R = 20 Vdc
V _R = 75 Vdc
Diode Capacitance (V_R = 0, f = 1.0 MHz))
Forward Voltage
I _F = 10 mAdc
Reverse Recovery Time (I_F = I_R = 10 mAdc)
1.FR–5 = 1.0 X 0.75X 0.062 in. 2.Alumina = 0.4X 0.3X 0.024 in. 99.5% alumina.
Symbol
V_R
I_F
I_FM(surge)
Symbol
P_D
R_șJA
P_D
R_șJA
T_J, T_stg
Symbol
V_(BR)
I_R
C_T
V_F
Trr
Value
100
200
500
Max
225
1.8
556
300
2.4
417
–55 to +150
Min
100
-
-
-
Units
V_DC
mAdc
mAdc
Units
mW
mW/°C
°C/W
mW
mW/°C
°C/W
°C
Max
-
25
50
4.0
1.0
4.0
Units
Vdc
nAdc
uAdc
pF
Vdc
nS
MDS0210002A
Page 1