MS611PYA Datasheet, PDF (1/4 Pages) Coilcraft lnc. – High Reliability Power Inductors

1010 POWER INDUCTORS
High Reliability Power Inductors MS611PYA
■ High temperature materials allow operation in ambient
temperatures up to 155°C
■ Tin-lead (Sn-Pb) termination for the best possible board
adhesion
■ High current and very low DCR
■ Soft saturation makes them ideal for VRM/VRD applications.
Core material Composite
Terminations  Tin-lead (63/37) over copper.
Weight  5.7 – 6.3 g
Ambient temperature  –55°C to +105°C with Irms current, +105°C
to +155°C with derated current
Storage temperature  Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C
Resistance to soldering heat  Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Moisture Sensitivity Level (MSL)  1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging  300/13″ reel 
Plastic tape:  24 mm wide, 0.4 mm thick, 16 mm pocket spacing,
10.21 mm pocket depth

  _{Part number}1
MS611PYA221MSZ
MS611PYA451MSZ
MS611PYA102MSZ
MS611PYA152MSZ
MS611PYA222MSZ
MS611PYA332MSZ
MS611PYA472MSZ
MS611PYA562MSZ
MS611PYA682MSZ
MS611PYA822MSZ
MS611PYA103MSZ
MS611PYA153MSZ
  _Inductance2
±20% (µH)
0.22
0.45
1.0
1.5
2.2
3.3
4.7
5.6
6.8
8.2
10
15
 DCR (mOhms)³
typ   max
0.33
0.37
0.60
0.66
1.00
1.10
1.60
1.76
2.55
2.80
3.70
5.20
6.30
8.10
11.70
4.10
5.70
6.93
8.90
12.90
13.40
16.90
14.75
18.60
 SRF (MHz)⁴
min   typ
92
115
53
66
34
42
26
33
18
22
17
21
15
19
13
16
11
14
9
12
8
11
7
9
1. When ordering, please specify testing code:
MS611PYA682MSZ
Testing: Z = COTS
H = Screening per Coilcraft CP-SA-10001
N = Screening per Coilcraft CP-SA-10004
2. Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc.
3. DCR measured on a micro-ohmmeter.
4. SRF measured using an Agilent/HP 4395A or equivalent.
5. Typical dc current at which the inductance drops 30% from its value without current.
6. Typical current that causes the specified temperature rise from 25°C ambient.
7. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
Isat (A)⁵
98.8
70.5
55.0
36.6
34.0
27.4
25.4
23.6
21.8
18.3
17.5
15.5
Irms (A)⁶
20°C rise   40°C rise
30.8
41.6
30.0
39.8
24.0
32.6
23.3
30.4
18.4
24.0
13.7
18.8
13.1
18.0
11.8
15.9
10.5
13.9
9.7
12.8
8.6
11.6
7.4
10.4
Irms Testing
Irms testing was performed on a
0.060″ thick pcb with 4 oz. copper
traces optimized to minimize
additional temperature rise.
Temperature rise is highly
dependent on many factors
including pcb land pattern,
trace size, and proximity to
other components. Therefore
temperature rise should be
verified in application conditions.
© Coilcraft, Inc. 2012
Document MS804-1  Revised 08/14/12
®
1102 Silver Lake Road
Cary, IL 60013
Phone [phone]
Fax [phone]
Email [e-mail]
www.coilcraft-cps.com
This product may not be used in medical or high
risk applications without prior Coilcraft approval.
Specifications subject to change without notice.
Please check our web site for latest information.