MS524PYA Datasheet, PDF (1/3 Pages) Coilcraft lnc. – High Reliability Power Inductors

6060 POWER INDUCTORS
High Reliability Power Inductors MS524PYA
■ High temperature materials allow operation in ambient
temperatures up to 155°C
■ Passes vibration testing to 80 G and shock testing to 1000 G
■ Exceptionally low DCR – 3.1 mOhm
■ Soft saturation makes them ideal for VRM/VRD applications.
Terminations  Tin-lead (63/37) over copper.
Core material Composite
Weight  1.2 – 1.3 g
Ambient temperature  –55°C to +105°C with Irms current, +105°C
to +155°C with derated current
Storage temperature  Component: –55°C to +155°C.
T&R packaging: –55°C to +80°C
Resistance to soldering heat  Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Moisture Sensitivity Level (MSL)  1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging  400/7″reel
Plastic tape:  16 mm wide, 0.3 mm thick, 12 mm pocket spacing,
3.12 mm pocket depth

  _{Part number}1
MS524PYA681MSZ
MS524PYA102MSZ
MS524PYA182MSZ
MS524PYA222MSZ
MS524PYA302MSZ
MS524PYA472MSZ
MS524PYA562MSZ
MS524PYA682MSZ
MS524PYA822MSZ
MS524PYA103MSZ
MS524PYA153MSZ
MS524PYA223MSZ
  _Inductance2
±20% (µH)
0.68
1.0
1.8
2.2
3.0
4.7
5.6
6.8
8.2
10
15
22
 DCR (mOhms)³
typ   max
3.10
3.41
3.81
4.19
5.30
5.83
6.00
6.60
7.45
8.19
14.90
16.22
18.90
24.00
27.00
16.40
17.84
20.80
26.40
29.82
39.77
55.12
43.75
60.63
 SRF (MHz)⁴
min   typ
47
59
37
47
28
36
24
31
20
26
16
21
16
20
14
18
12
16
11
14
8.8
11
7.2
9
1. When ordering, please specify testing code:
MS524PYA332MSZ
Testing: Z = COTS
H = Screening per Coilcraft CP-SA-10001
N = Screening per Coilcraft CP-SA-10004
2. Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc.
3. DCR measured on a micro-ohmmeter.
4. SRF measured using an Agilent/HP 4395A or equivalent.
5. Typical dc current at which the inductance drops 30% from its value without current.
6. Typical current that causes the specified temperature rise from 25°C ambient.
7. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
Isat (A)⁵
23
21
18.1
16.4
14.6
10.5
9.9
9.2
8.4
7.6
5.8
5.6
Irms (A)⁶
20°C rise   40°C rise
14.3
18.8
12.8
17.3
10.5
13.5
9.8
12.8
9.0
12.0
5.3
7.5
5.3
7.5
5.3
6.8
4.5
6.0
3.8
5.3
3.4
4.5
2.7
3.8
Irms Testing
Irms testing was performed on a
0.060″ thick pcb with 4 oz. copper
traces optimized to minimize additional
temperature rise.
Temperature rise is highly dependent
on many factors including pcb land
pattern, trace size, and proximity
to other components. Therefore
temperature rise should be verified in
application conditions.
© Coilcraft, Inc. 2012
Document MS799-1  Revised 09/24/12
®
1102 Silver Lake Road
Cary, IL 60013
Phone [phone]
Fax [phone]
Email [e-mail]
www.coilcraft-cps.com
This product may not be used in medical or high
risk applications without prior Coilcraft approval.
Specifications subject to change without notice.
Please check our web site for latest information.