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MS515PYA Datasheet, PDF (1/4 Pages) Coilcraft lnc. – High-Reliability Power Inductors
5050 POWER INDUCTORS
High-Reliability Power Inductors MS515PYA
■ High temperature materials allow operation in ambient
temperatures up to 155°C
■ Passes vibration testing to 80 G and shock testing to 1000 G
■ Tin-lead (Sn-Pb) termination for the best possible board
adhesion
■ High current and very low DCR
■ Soft saturation makes them ideal for VRM/VRD applications.
Core material Composite
Terminations  Tin-lead (63/37) over copper.
Weight  102 – 107 mg
Ambient temperature  –55°C to +105°C with Irms current, +105°C to
+155°C with derated current
Storage temperature  Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C
Resistance to soldering heat  Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Moisture Sensitivity Level (MSL)  1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging  250 per 7″ reel
Plastic tape:  16 mm wide, 0.3 mm thick, 8 mm pocket spacing,
5.21 mm pocket depth
  Part number1
MS515PYA561MSZ
MS515PYA821MSZ
MS515PYA122MSZ
MS515PYA152MSZ
MS515PYA222MSZ
MS515PYA332MSZ
MS515PYA472MSZ
MS515PYA562MSZ
MS515PYA682MSZ
MS515PYA822MSZ
MS515PYA103MSZ
MS515PYA153MSZ
MS515PYA223MSZ
  Inductance2
±20% (µH)
0.56
0.82
1.2
1.5
2.2
3.3
4.7
5.6
6.8
8.2
10
15
22
 DCR (mOhms)3
typ   max
4.15
4.56
5.15
5.66
6.16
6.76
7.10
7.80
9.05
9.95
16.90
21.95
23.45
26.75
31.75
18.60
24.15
25.80
29.45
34.95
40.90
69.70
90.60
45.00
76.70
99.65
 SRF (MHz)4
min   typ
77
96
50
63
43
54
38
48
33
41
27
34
23
29
20
25
17
21
14
18
12
15
10
13
9
11
1. When ordering, please specify testing code:
MS515PYA223MSZ
Testing: Z = COTS
H = Screening per Coilcraft CP-SA-10001
N = Screening per Coilcraft CP-SA-10004
2. Inductance tested at 100 kHz, 0.1 Vrms using an Agilent/HP 4192A.
3. DCR measured on a micro-ohmmeter.
4. SRF measured using Agilent/HP 4395A or equivalent.
5. Typical dc current at which the inductance drops 30% from its value without current.
6. Typical current that causes the specified temperature rise from 25°C ambient.
7. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
Isat (A)5
18.1
14.8
12.9
11.5
9.5
7.4
6.3
5.7
5.4
5.1
4.6
3.5
2.8
Irms (A)6
20°C rise   40°C rise
10.7
14.3
8.9
12.4
8.7
11.9
8.4
11.6
6.8
9.5
5.3
7.0
4.6
6.2
4.0
5.4
3.5
4.8
3.4
4.6
2.7
3.7
2.2
2.9
1.9
2.6
Irms Testing
Irms testing was performed on a
0.060″ thick pcb with 4 oz. copper
traces optimized to minimize
additional temperature rise.
Temperature rise is highly
dependent on many factors
including pcb land pattern,
trace size, and proximity to
other components. Therefore
temperature rise should be
verified in application conditions.
© Coilcraft, Inc. 2012
Document MS793-1  Revised 07/20/12
®
1102 Silver Lake Road
Cary, IL 60013
Phone 800-981-0363
Fax 847-639-1508
Email cps@coilcraft.com
www.coilcraft-cps.com
This product may not be used in medical or high
risk applications without prior Coilcraft approval.
Specifications subject to change without notice.
Please check our web site for latest information.