MS512PYA Datasheet, PDF (1/3 Pages) Coilcraft lnc. – High Reliability Power Inductors

6030 POWER INDUCTORS
High Reliability Power Inductors MS512PYA
■ High temperature materials allow operation in ambient
temperatures up to 155°C
■ Tin-lead (Sn-Pb) termination for the best possible board
adhesion
■ Passes vibration testing to 80 G and shock testing to 1000 G
■ Exceptionally low DCR; soft saturation
Terminations  Tin-lead (63/37) over copper.
Core material Composite
Weight  0.6 – 0.7 g
Ambient temperature  –55°C to +105°C with Irms current, +105°C
to +155°C with derated current
Storage temperature  Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C
Resistance to soldering heat  Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Moisture Sensitivity Level (MSL)  1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging  400/7″reel
Plastic tape:  16 mm wide, 0.3 mm thick, 12 mm pocket spacing,
3.12 mm pocket depth

  _{Part number}1
MS512PYA181MSZ
MS512PYA331MSZ
MS512PYA561MSZ
MS512PYA102MSZ
MS512PYA122MSZ
MS512PYA182MSZ
MS512PYA222MSZ
MS512PYA332MSZ
  _Inductance2
±20% (µH)
0.18
0.33
0.56
1.0
1.2
1.8
2.2
3.3
 DCR (mOhms)³
typ   max
1.59
1.75
2.30
2.53
3.01
3.31
5.62
6.18
6.82
7.50
9.57
12.70
19.92
10.52
13.97
20.81
 SRF (MHz)⁴
min   typ
113
141
71
89
49
61
40
50
34
43
27
34
24
30
21
26
Isat (A)⁵
39
30
29
23
22
18.2
15.9
12.2
Irms (A)⁶
20°C rise   40°C rise
18.0
24.0
15.0
18.8
12.0
16.5
9.8
13.5
9.0
12.0
7.6
10.5
5.3
7.5
4.5
6.0
1. When ordering, please specify testing code:
MS512PYA332MSZ
Testing: Z = COTS
H = Screening per Coilcraft CP-SA-10001
N = Screening per Coilcraft CP-SA-10004
2. Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc.
3. DCR measured on a micro-ohmmeter.
4. SRF measured using an Agilent/HP 4395A or equivalent.
5. Typical dc current at which the inductance drops 30% from its value without current.
6. Typical current that causes the specified temperature rise from 25°C ambient.
7. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
Irms Testing
Irms testing was performed on a
0.060″ thick pcb with 4 oz. copper
traces optimized to minimize
additional temperature rise.
Temperature rise is highly
dependent on many factors
including pcb land pattern,
trace size, and proximity to
other components. Therefore
temperature rise should be
verified in application conditions.
© Coilcraft, Inc. 2012
®
Document MS800-1  Revised 09/17/12
1102 Silver Lake Road
Cary, IL 60013
Phone [phone]
Fax [phone]
Email [e-mail]
www.coilcraft-cps.com
This product may not be used in medical or high
risk applications without prior Coilcraft approval.
Specifications subject to change without notice.
Please check our web site for latest information.