MS486PYA Datasheet, PDF (1/3 Pages) Coilcraft lnc. – High-Reliability Power Inductors

5030 POWER INDUCTORS
High-Reliability Power Inductors MS486PYA
■ High temperature materials allow operation in ambient
temperatures up to 155°C
■ Passes vibration testing to 80 G and shock testing to 1000 G
■ Tin-lead (Sn-Pb) termination for the best possible board
adhesion
■ High current and very low DCR
■ Soft saturation makes them ideal for VRM/VRD applications.
Core material Composite
Terminations  Tin-lead (63/37) over copper.
Weight  0.44 – 0.51 g
Ambient temperature  –55°C to +105°C with Irms current, +105°C to
+155°C with derated current
Storage temperature  Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C
Resistance to soldering heat  Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Moisture Sensitivity Level (MSL)  1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging  250 per 7″reel
Plastic tape:  16 mm wide, 0.3 mm thick, 8 mm pocket spacing,
5.21 mm pocket depth

  _{Part number}1
MS486PYA161MSZ
MS486PYA331MSZ
MS486PYA601MSZ
MS486PYA801MSZ
MS486PYA122MSZ
MS486PYA222MSZ
MS486PYA332MSZ
MS486PYA472MSZ
  _Inductance2
±20% (µH)
0.16
0.33
0.60
0.80
1.2
2.2
3.3
4.7
 DCR (mOhms)³
typ   max
2.15
2.36
3.20
3.52
4.11
4.52
5.14
5.65
8.50
13.20
21.20
32.70
9.40
14.50
23.30
36.00
 SRF (MHz)⁴
min   typ
146
183
86
108
60
75
50
63
49
61
30
38
22
28
18
23
1. When ordering, please specify testing code:
MS486PYA472MSZ
Testing: Z = COTS
H = Screening per Coilcraft CP-SA-10001
N = Screening per Coilcraft CP-SA-10004
2. Inductance tested at 100 kHz, 0.1 Vrms using an Agilent/HP 4192A.
3. DCR measured on a micro-ohmmeter.
4. SRF measured using Agilent/HP 4395A or equivalent.
5. Typical dc current at which the inductance drops 30% from its value without current.
6. Typical current that causes the specified temperature rise from 25°C ambient.
7. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
Isat (A)⁵
31.0
23.0
17.6
15.1
12.5
9.1
7.1
5.8
Irms (A)⁶
20°C rise   40°C rise
10.7
16.7
10.4
14.4
10.2
13.3
7.5
9.8
6.5
8.3
5.4
7.3
4.4
6.1
3.2
4.4
Irms Testing
Irms testing was performed on a
0.060″ thick pcb with 4 oz. copper
traces optimized to minimize
additional temperature rise.
Temperature rise is highly
dependent on many factors
including pcb land pattern,
trace size, and proximity to
other components. Therefore
temperature rise should be
verified in application conditions.
© Coilcraft, Inc. 2012
Document MS794-1  Revised 07/20/12
®
1102 Silver Lake Road
Cary, IL 60013
Phone [phone]
Fax [phone]
Email [e-mail]
www.coilcraft-cps.com
This product may not be used in medical or high
risk applications without prior Coilcraft approval.
Specifications subject to change without notice.
Please check our web site for latest information.