MS433PYA Datasheet, PDF (1/3 Pages) Coilcraft lnc. – High Reliability Power Inductors

4020 POWER INDUCTORS
High Reliability Power Inductors MS433PYA
Part number¹
MS433PYA221MSZ
MS433PYA401MSZ
MS433PYA601MSZ
MS433PYA102MSZ
MS433PYA152MSZ
MS433PYA222MSZ
Inductance²
±20% (µH)
0.22
0.40
0.60
1.0
1.5
2.2
DCR (mOhms)³
typ
max
5.81
7.55
9.50
13.25
21.45
35.20
6.40
8.30
10.45
14.60
23.60
38.70
I High temperature materials allow operation in ambient
temperatures up to 155°C
I Tin-lead (Sn-Pb) termination for the best possible board
adhesion
I Exceptionally low DCR – 5.81 mOhm
I Soft saturation makes them ideal for VRM/VRD applications.
Terminations Tin-lead (63/37) over copper.
Core material Composite
Weight 0.17 – 0.18 g
Ambient temperature –55°C to +105°C with Irms current, +105°C to
+155°C with derated current
Storage temperature Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C
Resistance to soldering heat Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging 1000/7″reel; 3500/13″ reel
Plastic tape: 12 mm wide, 0.23 mm thick, 8 mm pocket spacing,
2.3 mm pocket depth
SRF (MHz)⁴
min
typ
153
191
116
145
85
106
63
79
51
64
42
52
Isat⁵
(A)
18.7
12.5
10.4
8.7
7.1
5.6
Irms (A)⁶
20°C rise 40°C rise
12.0
16.8
10.0
14.0
7.9
11.7
6.7
9.6
5.2
7.5
4.0
5.5
1. When ordering, please specify testing code:
MS433PYA222MSZ
Testing: Z = COTS
H = Screening per Coilcraft CP-SA-10001
N = Screening per Coilcraft CP-SA-10004
2. Inductance tested at 100 kHz, 0.1 Vrms, 0 Adc.
3. DCR measured on a micro-ohmmeter.
4. SRF measured using an Agilent/HP 4395A or equivalent.
5. Typical dc current at which the inductance drops 30% from its value without current.
6. Typical current that causes the specified temperature rise from 25°C ambient.
7. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
Irms Testing
Irms testing was performed on 0.75 inch
wide × 0.25 inch thick copper traces in
still air.
Temperature rise is highly dependent on
many factors including pcb land pattern,
trace size, and proximity to other compo-
nents. Therefore temperature rise should
be verified in application conditions.
© Coilcraft, Inc. 2012
®
Specifications subject to change without notice.
Please check our website for latest information. Document MS806-1 Revised 01/18/12
1102 Silver Lake Road
Cary IL 60013
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Web www.coilcraft-cps.com