MS413RAM Datasheet, PDF (1/2 Pages) Coilcraft lnc. – High-Reliability Chip Inductors

1008 CHIP INDUCTORS
High-Reliability Chip Inductors MS413RAM
■ Ferrite construction provides lowest DCR and highest current
rating of our 1008 size inductors.
■ Available in 14 inductance values from 0.9 to 10 µH, all at
10% tolerance.
This robust version of Coilcraft’s standard 1008AF series
features high temperature materials that allow opera-
tion in ambient temperatures up to 155°C. The tin-lead
(Sn-Pb) terminations ensure the best possible board
adhesion.

  _{Part number}1
MS413RAM901KSZ
MS413RAM112KSZ
MS413RAM132KSZ
MS413RAM152KSZ
MS413RAM192KSZ
MS413RAM222KSZ
MS413RAM272KSZ
MS413RAM332KSZ
MS413RAM392KSZ
MS413RAM472KSZ
MS413RAM582KSZ
MS413RAM682KSZ
MS413RAM822KSZ
MS413RAM103KSZ
  _Inductance2
±10% (µH)
0.9
1.1
1.3
1.5
1.9
2.2
2.7
3.3
3.9
4.7
5.8
6.8
8.2
10.0
  _{Q typ}3
25
24
37
22
29
21
22
21
21
27
21
20
20
22
  _{SRF min}4
(MHz)
415
376
198
135
126
106
70
59
55
48
37
33
34
26
  _{DCR max}5
(Ohms)
0.120
0.130
0.145
0.155
0.180
0.186
0.210
0.240
0.260
0.450
0.320
0.355
0.380
0.540
  _Isat6
(A)
1.4
1.3
1.2
1.1
1.0
0.95
0.80
0.75
0.70
0.70
0.55
0.50
0.50
0.45
Imax
(A)
.076
0.72
0.64
0.62
0.60
0.58
0.57
0.53
0.50
0.36
0.45
0.42
0.42
0.36
1. When ordering, please specify testing code:
MS413RAM103KSZ
Testing: Z = COTS
H = Screening per Coilcraft CP-SA-10001
N = Screening per Coilcraft CP-SA-10003
2. Inductance measured at 2.5 MHz using Coilcraft SMD-A fixture in an
Agilent/HP 4286A impedance analyzer or equivalent with Coilcraft-
provided correlation pieces.
3. Q measured at 2.5 MHz using an Agilent/HP 4291A with an Agilent/HP
16197 test fixture or equivalents.
4. SRF measured using an Agilent/HP 8753ES network analyzer or
equivalent with a Coilcraft SMD-D fixture.
5. DCR measured on a Keithley 580 micro-ohmmeter or equivalent and a
Coilcraft CCF858 test fixture.
6. DC current at which the inductance drops 10% (typ.) from its value
without current.
7. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
Core material Ferrite
Terminations  Tin-lead (63/37) over silver-platinum-glass frit
Ambient temperature  –55°C to +125°C with Imax current, +125°C
to +155°C with derated current
Storage temperature  Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C
Resistance to soldering heat  Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL)  +100 to +350 ppm/°C
Moisture Sensitivity Level (MSL)  1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging  2000 per 7″ reel
Plastic tape:  8 mm wide, 0.3 mm thick, 4 mm pocket spacing,
2.0 mm pocket depth
© Coilcraft, Inc. 2011
®
Specifications subject to change without notice.
Please check our website for latest information. Document MS578-1  Revised 11/17/11
1102 Silver Lake Road
Cary IL 60013
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Web www.coilcraft-cps.com