ML413RAD Datasheet, PDF (1/2 Pages) Coilcraft lnc. – High-Reliability Chip Inductors

1008 CHIP INDUCTORS
High-Reliability Chip Inductors ML413RAD
This robust version of Coilcraft’s standard 1008HQ series
features high temperature materials that allow operation
in ambient temperatures up to 155°C.

  _{Part number}1
ML413RAD3N0_LZ²
ML413RAD4N1_LZ
ML413RAD7N8_LZ²
ML413RAD10N_LZ
ML413RAD12N_LZ
ML413RAD18N_LZ
ML413RAD22N_LZ
ML413RAD33N_LZ
ML413RAD36N_LZ
ML413RAD39N_LZ
ML413RAD47N_LZ
ML413RAD56N_LZ
ML413RAD68N_LZ
ML413RAD82N_LZ
ML413RADR10_LZ
  _Inductance3
(nH)
3.0 @ 50 MHz
4.1 @ 50 MHz
7.8 @ 50 MHz
10 @ 50 MHz
12 @ 50 MHz
18 @ 50 MHz
22 @ 50 MHz
33 @ 50 MHz
36 @ 50 MHz
39 @ 50 MHz
47 @ 50 MHz
56 @ 50 MHz
68 @ 50 MHz
82 @ 50 MHz
100 @ 50 MHz
Percent ^  SRF min⁵
tolerance
Q min⁴
(GHz)
5
57 @ 1000 MHz
>5.00
5
75 @ 1000 MHz
>5.00
5
51 @ 500 MHz
3.80
5,2
60 @ 500 MHz
3.20
5,2
57 @ 500 MHz
2.40
5,2
62 @ 350 MHz
2.10
5,2
62 @ 350 MHz
2.05
5,2
49 @ 150 MHz
1.70
5,2
57 @ 150 MHz
1.40
5,2
45 @ 150 MHz
1.30
5,2,1
45 @ 150 MHz
1.45
5,2,1
43 @ 150 MHz
1.08
5,2,1
54 @ 150 MHz
1.15
5,2,1
54 @ 150 MHz
1.06
5,2,1
51 @ 150 MHz
0.82
  _{DCR max}6
(mOhms)
38
50
50
60
60
70
70
90
90
90
120
120
130
160
160
Imax
(A)
1.8
1.8
1.6
1.5
1.5
1.4
1.4
1.2
1.1
1.1
0.95
0.95
0.85
0.80
0.80
1. When ordering, please specify tolerance and testing codes:
ML313RADR10JLZ
Tolerance: F = 1%  G = 2%  J = 5%
Testing: Z = COTS
H = Screening per Coilcraft CP‑SA‑10001
N = Screening per Coilcraft CP‑SA‑10003
2. Part is wound on low profile coilform.
3. Inductance measured using a Coilcraft SMD-A fixture in an Agilent/
HP 4286A impedance analyzer or equivalent with Coilcraft-provided
correlation pieces.
4. Q measured using an Agilent/HP 4291A with an AgilentHP 16197A
test fixture or equivalents.
5. SRF measured using an Aglilent/HP 8753ES network analyzeror
equivalent and a Coilcraft SMD-D test fixture.
6. DCR measured on a Keithley 580 micro-ohmmeter or equivalent and a
Coilcraft CCF858 test fixture.
7. Electrical specifications at 25°C.
Refer to Doc 362 “Soldering Surface Mount Components” before soldering.
Core material Ceramic
Terminations  Silver-palladium-platinum-glass frit.
Ambient temperature  –55°C to +125°C with Imax current, +125°C
to +155°C with derated current
Storage temperature  Component: –55°C to +155°C.
Tape and reel packaging: –55°C to +80°C
Resistance to soldering heat  Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL)  +25 to +155 ppm/°C
Moisture Sensitivity Level (MSL)  1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging   2000/7″reel
Standard height parts:  Plastic tape:  8 mm wide, 0.23 mm thick,
4 mm pocket spacing, 1.8 mm pocket depth
Low profile parts:  Plastic tape:  8 mm wide, 0.3 mm thick,
4 mm pocket spacing, 1.6 mm pocket depth
© Coilcraft, Inc. 2012
Document ML190-1  Revised 11/06/12
®
1102 Silver Lake Road
Cary, IL 60013
Phone [phone]
Fax [phone]
Email [e-mail]
www.coilcraft-cps.com
This product may not be used in medical or high
risk applications without prior Coilcraft approval.
Specifications subject to change without notice.
Please check our web site for latest information.