LPD4012_15 Datasheet, PDF (1/3 Pages) Coilcraft lnc. – Coupled Inductors

Document 580-1
Coupled Inductors – LPD4012 ForFlyback,SEPIC
and other Applications
• Only 1.1 mm high and 4 mm square
• Ideal for use in flyback, multi-output buck and SEPIC
applications.
• High inductance, high efficiency and excellent current handling
• Can also be used as two single inductors connected in
series or parallel or as a common mode choke.
+
D
L1
L2
C
V_IN
C
SW
+
V_OUT
–
–
Typical Flyback Converter
0.155 ±0.003
3,94 ±0,076
1
4
0.155 ±0.003
3,94 ±0,076
2 ^{XXX X} 3
Dash Internal
number code
Dot indicates pin 1
0.0433 ±0.004
1,10 ±0,10
Recommended
Land Pattern
1
0.103 0.049
2,606 1,24
0.031
0,78
4 _45°
typ
0.174
4,40
0.060
1,52
1
4
L1
L2
2
3
2
3
0.049
1,24
0.103
2,606
0.174
4,40
Dimensions are
in
inches
mm
L2 ^{D C}
+
V_OUTAUX
–
+
+
L1
V_IN
D
SW
C
V_OUT
–
–
Typical Buck Converter with auxiliary output
+
V_IN C
L1
Q
C1
L2
D
C
+
V_OUT
–
–
Typical SEPIC schematic
Core material Ferrite
Core and winding loss  Go to online calculator
W+eight  54 – 64 mg
+
Environmental_Q  RoHS compliaCn1t, halogen free^L2
T_OVe_INthrm_eri_Cn_tea_rt_mio_inn_as_{t ioRnosHaSvaciolambplLel1}iaant tamddaitttieontiaDnl
over nickel
cost.
o_Cver
silverV. _OUT
Ambient temperature  –40°C to +85°C with (40°C rise) Irms current.
M^–aximum part temperature  +125°C (ambient + temp rise).
–
Storage temperatu^Tre^y ^pCⁱo^cm^alp^Zon^ee^tant:^s–^c4^h0^e°C^mt^ao^ti+^c125°C.
Tape and reel packaging: –40°C to +80°C
Winding to winding isolation  100 V
Resistance to soldering heat  Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Moisture Sensitivity Level (MSL)  1 (unlimited floor life at <30°C /
85% relative humidity)
Failures in Time (FIT) / Mean Time Between Failures (MTBF)
38 per billion hours / 26,315,789 hours, calculated per Telcordia SR-332
Packaging  1000/7″ reel; 3500/13″ reel  Plastic tape:  12 mm wide,
0.25 mm thick, 8 mm pocket spacing, 1.32 mm pocket depth
Recommended pick and place nozzle  OD: 4 mm; ID: ≤ 2 mm
PCB washing  Tested to MIL-STD-202 Method 215 plus an additional
aqueous wash. See Doc787_PCB_Washing.pdf.
Document 580-1  Revised 11/09/15