OAA160_1 Datasheet, PDF (5/6 Pages) Clare, Inc. – Dual Pole OptoMOS® Relays

OAA160
Manufacturing Information
Soldering
For proper assembly, the component must be
processed in accordance with the current revision
of IPC/JEDEC standard J-STD-020. Failure to
follow the recommended guidelines may cause
permanent damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
Recommended soldering processes are limited to
260ºC component body temperature for 10 seconds.
Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
RoHS
2002/95/EC
e3
8 Pin DIP Through Hole (Standard)
MECHANICAL DIMENSIONS
PC Board Pattern
(Top View)
8 Pin DIP Surface Mount (“S” Suffix)
8 Pin Flatpack (“P” Suffix)
PC Board Pattern
(Top View)
2.540 ± 0.127
(0.100 ± 0.005)
1.905 ± 0.127
(0.075 ± 0.005)
1.498 ± 0.127
(0.059 ± 0.005)
8.305 ± 0.127
(0.327 ± 0.005)
PC Board Pattern
(Top View)
±
±
Dimensions:
mm
(inches)
R06
www.clare.com
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