IAA110P Datasheet, PDF (5/6 Pages) Clare, Inc. – Integrated Telecom Circuits

IAA110P
Mechanical Dimensions
16 Pin SOIC (“P” Suffix)
10.160 ± .051
(.400 ± .002)
1.981 TYP.
(.078)
7.493 ± .051
(.295 ± .002)
1.270 TYP.
(.050)
2.108 MAX.
(.083)
1.016
(.040)
7.493 ± .127
(.295 ± .005)
.254
(.010)
10.363 ± .127
(.408 ± .005)
.406 TYP.
(.016)
8.890 TYP.
(.350)
PC Board Pattern
(Top View)
1.270
(.050)
1.193
(.047)
.787
(.031)
9.728 ± .051
(.383 ± .002)
Tape and Reel Packaging for 16 Pin SOIC Package
330.2 DIA.
(13.00)
Top Cover
Tape Thickness
.102 MAX.
(.004)
6.731 MAX.
(.265)
1.753 ± .102
(.069 ± .004)
.406 MAX.
(.016)
7.493 ± .102
(.295 ± .004)
12.090
(.476)
3.175
(.125)
2.007 ± .102 1.498 ± .102 3.987 ± .102
(.079 ± .004) (.059 ± .004) (.157 ± .004)
1 16
16.002 ± .305
(.630 ± .012)
10.693 ± .025
(.421 ± .001)
Embossed Carrier
Embossment
Top Cover
Tape
.050R TYP.
11.989 ± .102
(.472 ± .004)
10.897 ± .025 1.549 ± .102
(.429 ± .001) (.061 ± .004)
User Direction of Feed
Dimensions
mm
(inches)
Rev. 2
5