CPC1560 Datasheet, PDF (13/14 Pages) Clare, Inc. – Solid State Relay with Integrated Current Limit

6. Manufacturing Information
6.1 Soldering
For proper assembly, the component must be
processed in accordance with the current revision of
IPC/JEDEC standard J-STD-020. Failure to follow the
recommended guidelines may cause permanent
damage to the device resulting in impaired
performance and/or a reduced lifetime expectancy.
6.3 Mechanical Dimensions
8-Pin DIP Through-Hole Package
CPC1560
6.2 Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated hydrocarbons.
Pb
RoHS
2002/95/EC
e3
PC Board Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
7.620 ± 0.254
(0.300 ± 0.010)
9.144 ± 0.508
(0.360 ± 0.020)
8-0.800 DIA.
(8-0.031 DIA.)
6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
4.064 TYP
(0.160)
3.302 ± 0.051
(0.130 ± 0.002)
7.239 TYP.
(0.285)
0.254 TYP
(0.01)
7.620 ± 0.127
(0.300 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
0.889 ± 0.102
(0.035 ± 0.004)
8-Pin Surface Mount Package
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
3.302 ± 0.051
(0.130 ± 0.002)
9.525 ± 0.254
(0.375 ± 0.010)
7.620 ± 0.254
(0.300 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
4.445 ± 0.127
(0.175 ± 0.005)
0.813 ± 0.120
(0.032 ± 0.004)
Dimensions
mm
(inches)
Recommended PCB Land Pattern
0.635 ± 0.127
(0.025 ± 0.005)
1.65
(0.0649)
2.54
(0.10)
8.90
(0.3503)
0.254 ± 0.127
(0.010 ± 0.0005)
0.65
(0.0255)
Dimensions
mm
(inches)
R00F
PRELIMINARY
13