CPC1979_11 Datasheet, PDF (1/7 Pages) Clare, Inc. – ISOPLUS™-264 Power Relay

CPC1979
ISOPLUS™-264 Power Relay
Characteristics
Parameter
Blocking Voltage
Load Current, T_A=25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance
R_θJC
Rating
600
3.5
1.4
0.75
0.3
Units
V_P
A_rms
Ω
°C/W
Features
• 3.5A_rms Load Current with 5°C/W Heat Sink
• Low 0.75Ω On-Resistance
• 600V_P Blocking Voltage
• 2500V_rms Input/Output Isolation
• Low Thermal Resistance (0.3 °C/W)
• Electrically Non-conductive Thermal Pad for Heat
Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Applications
• Industrial Controls / Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Approvals
• UL 508 Recognized Component: File E69938
Pin Configuration
Description
Clare and IXYS have combined to bring OptoMOS^®
technology, reliability and compact size to a new family
of high-power Solid State Relays.
As part of this family, the CPC1979 single-pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 3.5A_rms continuous load current with a
5°C/W heat sink.
The CPC1979 employs optically coupled MOSFET
technology to provide 2500V_rms of input to output
isolation. The output, constructed with efficient
MOSFET switches and photovoltaic die, uses Clare’s
patented OptoMOS architecture while the input, a
highly efficient GaAlAs infrared LED, provides the
optically coupled control. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique ISOPLUS-264 package pioneered by
IXYS enables Solid State Relays to achieve the
highest load current and power ratings. This package
features a unique IXYS process in which the silicon
chips are soft soldered onto the Direct Copper Bond
(DCB) substrate instead of the traditional copper
leadframe. The DCB ceramic, the same substrate
used in high power modules, not only provides
2500V_rms isolation but also very low thermal
resistance (0.3 °C/W).
Ordering Information
Part
CPC1979J
Description
ISOPLUS-264 Package (25 per tube)
Switching Characteristics
Form-A
RoHS
2002/95/EC
DS-CPC1979 - R06
e3
I_F
I_LOAD
www.clare.com
90%
t_on
10%
t_off
1