CPC1977 Datasheet, PDF (1/6 Pages) Clare, Inc. – i4-PAC™ Power Relay

CPC1977
i4-PAC™ Power Relay
Parameter
Blocking Voltage
Load Current, T_A=25ºC
With 5°C/W Heat Sink
No Heat Sink
On-resistance
R_θJC
Rating
600
3.1
1.25
1
0.35
Units
V_P
A_rms
Ω
°C/W
Features
• Compact i4-PAC™ Power Package
• Low Thermal Resistance (0.35 °C/W)
• 3.1A_rms Load Current with 5°C/W Heat Sink
• Electrically Non-conductive Thermal Pad for Heat
Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• 2500V_rms Input/Output Isolation
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Applications
• Industrial Controls
• Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Pin Configuration
Description
Clare and IXYS have combined to bring OptoMOS^®
technology, reliability and compact size to a new
family of high power Solid State Relays.
As part of this family, the CPC1977 single pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 3.1A_rms continuous load current with a
5°C/W heat sink.
The CPC1977 employs optically coupled MOSFET
technology to provide 2500V_rms of input to output
isolation. The output is constructed with efficient
MOSFET switches and photovoltaic die that use
Clare’s patented OptoMOS architecture while the
input, a highly efficient GaAlAs infrared LED provides
the optically coupled control. The combination of
low on-resistance and high load current handling
capability makes this relay suitable for a variety of
high performance switching applications.
The unique i4-PAC package pioneered by IXYS
allows Solid State Relays to achieve the highest load
current and power ratings. This package features
a unique IXYS process where the silicon chips are
soft soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500V_rms isolation
but also very low thermal resistance (0.35 °C/W).
Approvals
• UL recognized component: File # E69938
• Certified to: UL 508
Ordering Information
Part #
CPC1977J
Description
i4-PAC (25 per tube)
Switching Characteristics of Normally
Open (Form A) Devices
RoHS
2002/95/EC
e3
DS-CPC1977-R04
CONTROL
I_LOAD
+90%
10%+
T_ON ^TOFF
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