CPC1909_10 Datasheet, PDF (1/7 Pages) Clare, Inc. – ISOPLUS™-264 Power Relay

Characteristics
Parameter
Blocking Voltage
Load Current, T_A=25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance
R_θJC
Rating
60
15
6.5
0.1
0.3
Units
V_P
A_rms
Ω
°C/W
Features
• 15A_rms Load Current with 5°C/W Heat Sink
• Low 0.1Ω On-Resistance
• 60V_P Blocking Voltage
• 2500V_rms Input/Output Isolation
• Low Thermal Resistance (0.3 °C/W)
• Electrically Non-conductive Thermal Pad for Heat
Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Applications
• Industrial Controls / Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Approvals
• UL 508 Certified Component: File E69938
Pin Configuration
CPC1909
Single-Pole, Normally Open
ISOPLUS™-264 Power Relay
Description
Clare and IXYS have combined to bring OptoMOS^®
technology, reliability and compact size to a new family
of high-power Solid State Relays.
As part of this family, the CPC1909 single-pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 15A_rms continuous load current with a
5°C/W heat sink.
The CPC1909 employs optically coupled MOSFET
technology to provide 2500V_rms of input to output
isolation. The output, constructed with efficient
MOSFET switches and photovoltaic die, uses Clare’s
patented OptoMOS architecture while the input, a
highly efficient GaAlAs infrared LED, provides the
optically coupled control. The combination of low
on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique ISOPLUS-264 package pioneered by
IXYS allows Solid State Relays to achieve the highest
load current and power ratings. This package features
a unique IXYS process where the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the traditional copper leadframe.
The DCB ceramic, the same substrate used in high
power modules, not only provides 2500V_rms isolation
but also very low thermal resistance (0.3 °C/W).
Ordering Information
Part
CPC1909J
Description
ISOPLUS-264 Package (25 per tube)
Switching Characteristics
Form-A
RoHS
2002/95/EC
DS-CPC1909 - R05
e3
I
F
I_LOAD
www.clare.com
90%
t_on
10%
t_off
1