CPC1708_10 Datasheet, PDF (1/7 Pages) Clare, Inc. – i4-PAC™ DC Power Relay

CPC1708
Single-Pole, Normally Open
i4-PAC™ DC Power Relay
Characteristics
Parameter
Blocking Voltage
Load Current, T_A=25°C:
With 5°C/W Heat Sink
No Heat Sink
On-Resistance
R_θJC
Rating
60
11.85
4
0.08
0.35
Units
V_P
A_DC
Ω
°C/W
Features
• 11.85A_DC Load Current with 5°C/W Heat Sink
• Low 0.08Ω On-Resistance
• 60V_P Blocking Voltage
• 2500V_rms Input/Output Isolation
• Low Thermal Resistance (0.35 °C/W)
• Electrically Non-Conductive Thermal Pad for Heat
Sink Applications
• Low Drive Power Requirements
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
Applications
• Industrial Controls / Motor Control
• Robotics
• Medical Equipment—Patient/Equipment Isolation
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Transportation Equipment
• Aerospace/Defense
Approvals
• UL 508 Certified Component: File E69938
• CSA Certified Component: Certificate 1172007
Pin Configuration
1
2
+
-
RoHS
2002/95/EC
34
-
+
e3
Description
Clare and IXYS have combined to bring OptoMOS^®
technology, reliability and compact size to a new family
of High Power Solid State Relays. As part of this new
family, the CPC1708 single-pole normally open
(1-Form-A) DC Solid State Relay employs optically
coupled MOSFET technology to provide 2500V_rms of
input to output isolation.
The output, constructed with an efficient MOSFET
switch and photovoltaic die, uses Clare’s patented
OptoMOS architecture while the input, a GaAlAs
infrared LED, provides the optically-coupled control.
The combination of low on-resistance and high load
current handling capability makes this relay suitable
for a variety of high performance DC switching
applications.
The unique i4-PAC package pioneered by IXYS
enables solid state relays to achieve the highest load
current and power ratings. This package features an
IXYS unique process where the silicon chips are soft
soldered onto the Direct Copper Bond (DCB)
substrate instead of the usual copper leadframe. The
DCB ceramic, the same substrate used in high power
modules, not only provides 2500V_rms isolation but also
very low thermal resistance (0.35°C/W).
Ordering Information
Part
CPC1708J
Description
i4-PAC Package (25 per tube)
Switching Characteristics
Form-A
I_F
I_LOAD
90%
t_on
10%
t_off
DS-CPC1708 - R04
www.clare.com
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