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DBF251 Datasheet, PDF (1/4 Pages) Chip Integration Technology Corporation – 20A Trench Schottky Rectifier
Chip Integration Technology Corporation
DBF251 THRU DBF2510
2.5A Bridge Rectifiers
■ Features
• Glass passivated die construction
• Low leakage
• High current capability
• Ideal for printed circuit board
• Design for surface mount application
• Suffix “G” indicates Halogen free parts, ex DBF251G
• Plastic Material-UL Flammability 94V-0
■ Mechanical data
• Case : DBF,Molded plastic.
• Terminals :plated leads solderable per
MIL-STD-202, Method 208.
• Polarity : as marked on case.
• Mounting position: Any.
• Marking: type number.
■ Outline
.047 (1.2)
.031 (0.8)
DBF
-
+
.165 (4.2)
.149 (3.8)
.205 (5.2)
.189 (4.8)
.270 (6.85)
.254 (6.45)
■ Circuit Diagram
■ Maximum ratings and electrical characteristics
■ Dimensions in inches and (millimeters)
Rating at 25OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz,resistive or inductive load.
For capacitive load, derate current by 20%
Parameter
Average rectified output current
Rating for fusing (t<8.3ms)
Non-Repetitive Peak
Forward surge current
Peak Reverse current
at rated DC blocking voltage
Typical Thermal resistance
per leg
Conditions
TC = 100OC (Note:1)
8.3ms single half sine-wave superimposed on
rate load (JEDEC method)
TA = 25OC
TA = 125OC
Typical Junction Capacitance
per leg(Note 2)
Symbol
IF(AV)
I2t
IFSM
IR
RθJA
RθJC
CJ
Value
2.5
59.76
120
5
200
70
15
41
Operating and Storage
temperature Range
T T J, STG
-55 to +150
UNIT
A
A2s
A
uA
OC/W
pF
OC
Symbol
Max.
Max.
repetitive peak Working peak
reverse voltage reverse voltage
VRRM (V)
VRWM (V)
Max. DC
blocking voltage
VDC (V)
DBF251
100
100
100
DBF252
200
200
200
DBF254
400
400
400
DBF256
600
600
600
DBF258
800
800
800
DBF2510
1000
Note: 1.Mounted on glass epoxy PC board with 1.3mm2 solder pad.
Note: 2.Measured at 1.0 MHZ and applied reverse voltage of 4.0V DC.
1000
1000
1
Max.
RMS voltage
VRMS (V)
70
140
280
420
560
700
forward voltage
per element
@IF=2.5A
VFM (V)
1.0
Document ID : DS-22B49
Revised Date : 2016/09/13
Revision : C