CSP8S60S-A Datasheet, PDF (1/3 Pages) Chip Integration Technology Corporation – Super Low Barrier High Voltage Power Rectifier

Chip Integration Technology Corporation
CSP8S60S-A
Super Low Barrier High Voltage Power Rectifier
Main Product Characteristics
I_F(AV)
V_RRM
T_J
V_(Typ)
8A
60V
150^OC
0.44V
■ Features
• Low forward voltage drop.
• Excellent high temperature stability.
• Fast switching capability.
• Suffix "G" indicates Halogen-free part, ex.CSP8S60SG-A.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
■ Mechanical data
• Epoxy : UL94-V0 rated flame retardant.
• Case : Molded plastic, TO-277.
• Lead : Solder plated, solderable per MIL-STD-750,
Method 2026.
• Polarity: Indicated by cathode band.
• Mounting Position : Any.
• Weight : Approximated 0.093 grams.
■ Outline
TO-277
0.073 (1.85)
0.069 (1.75)
0.264 (6.70)
0.248 (6.30)
1
2
3
PIN 2
PIN 1
PIN 3
0.077 (1.96)
0.069 (1.76)
0.028 (0.71)
0.016 (0.41)
0.216 (5.48)
0.208 (5.28)
0.028 (0.71)
0.016 (0.41)
0.124 (3.15)
0.112 (2.85)
0.014 (0.35)
0.010 (0.25)
0.145 (3.69)
0.133 (3.39)
0.037 (0.95)
0.033 (0.85)
0.037 (0.95)
0.033 (0.85)
0.069 (1.74)
0.057 (1.44)
0.049 (1.25)
0.037 (0.95)
Dimensions in inches and (millimeters)
■ Maximum ratings and electrical characteristics
Rating at 25^OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Parameter
Marking code
Peak repetitive reverse voltage
Working peak reverse voltage
DC blocking voltage
Forward rectified current
Forward surge current
Thermal resistance
Operating and Storage temperature
Conditions
Symbol
8.3ms single half sine-wave superimposed on
rate load (JEDEC method)
Junction to case
V_RRM
V_RWM
V_RM
I_O
I_FSM
R_θJC
T_J, T_STG
CSP8S60S-A
CSP8S60S
60
8
280
4
-55 ~ +150
UNIT
V
A
A
O_C/W
O_C
Parameter
Conditions
Symbol
I_F = 1.0A, T_J = 25^OC
Forward voltage drop
I_F = 8A, T_J = 25^OC
V_F
I_F = 8A, T_J = 125^OC
V_R = V_RRM T_J = 25^OC
Reverse current
I_R
V_R = V_RRM T_J = 125^OC
Note : 1.Theoretical RθJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
2.Polymide PCB, 2oz.Copper.
MIN.
TYP.
440
MAX.
350
530
500
0.6
100
UNIT
mV
mA
Document ID : DS-12KCG
1
Revised Date : 2015/08/11
Revision : C3