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CSP5S45S-A Datasheet, PDF (1/3 Pages) Chip Integration Technology Corporation – Super Low Barrier High Voltage Power Rectifier
Chip Integration Technology Corporation
CSP5S45S-A
Super Low Barrier High Voltage Power Rectifier
Main Product Characteristics
IF(AV)
VRRM
TJ
V(Typ)
5A
45V
150OC
0.35V
■ Features
• Low forward voltage drop.
• Excellent high temperature stability.
• Fast switching capability.
• Suffix "G" indicates Halogen-free part, ex.CSP5S45SG-A.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
■ Mechanical data
• Epoxy : UL94-V0 rated flame retardant.
• Case : Molded plastic, TO-277.
• Lead : Solder plated, solderable per MIL-STD-750,
Method 2026.
• Polarity: Indicated by cathode band.
• Mounting Position : Any.
• Weight : Approximated 0.093 grams.
■ Outline
TO-277
0.264 (6.70)
0.248 (6.30)
PIN 2
0.073 (1.85)
0.069 (1.75)
2
1
0.077 (1.96)
0.069 (1.76)
3
0.028 (0.71)
0.016 (0.41)
0.216 (5.48)
0.208 (5.28)
0.028 (0.71)
0.016 (0.41)
0.124 (3.15)
0.112 (2.85)
0.014 (0.35)
0.010 (0.25)
0.145 (3.69)
0.133 (3.39)
0.037 (0.95)
0.033 (0.85)
0.037 (0.95)
0.033 (0.85)
0.069 (1.74)
0.057 (1.44)
0.049 (1.25)
0.037 (0.95)
Dimensions in inches and (millimeters)
■ Maximum ratings and electrical characteristics
Rating at 25OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Parameter
Marking code
Peak repetitive reverse voltage
Working peak reverse voltage
DC blocking voltage
Forward rectified current
Forward surge current
Thermal resistance
Operating and Storage temperature
Conditions
Symbol
8.3ms single half sine-wave superimposed on
rate load (JEDEC method)
Junction to case
VRRM
VRWM
VRM
IO
IFSM
RθJC
TJ, TSTG
CSP5S45S-A
CSP5S45S
45
5
250
4
-55 ~ +150
PIN 1
PIN 3
UNIT
V
A
A
OC/W
OC
Parameter
Conditions
Symbol
IF = 5A, TJ = 25OC
Forward voltage drop
IF = 5A, TJ = 125OC
VF
IF = 10A, TJ = 25OC
VR = VRRM TJ = 25OC
Reverse current
IR
VR = VRRM TJ = 125OC
Note : 1.Theoretical RθJS calculated from the top center of the die straight down to the PCB cathode tab solder junction.
2.Polymide PCB, 2oz.Copper.
MIN.
TYP.
350
MAX.
435
380
520
0.5
100
UNIT
mV
mA
Document ID : DS-12KCL
1
Revised Date : 2015/08/06
Revision : C5