English
Language : 

CSP12S120S Datasheet, PDF (1/3 Pages) Chip Integration Technology Corporation – 12A Surface Mount Super Low Barrier Diode
Chip Integration Technology Corporation
CSP12S120S
12A Surface Mount Super Low Barrier Diode
Main Product Characteristics
IF(AV)
VRRM
TJ
V(Typ)
12A
120V
150OC
0.63V
■ Features
• Low forward voltage drop.
• Excellent high temperature stability.
• Fast switching capability.
• Suffix "G" indicates Halogen-free part, ex.CSP12S120SG.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
■ Mechanical data
• Epoxy : UL94-V0 rated flame retardant.
• Case : Molded plastic, TO-277.
• Lead : Solder plated, solderable per MIL-STD-750,
Method 2026.
• Polarity: Indicated by cathode band.
• Mounting Position : Any.
• Weight : Approximated 0.093 grams.
■ Outline
TO-277
0.073 (1.85)
0.069 (1.75)
0.264 (6.70)
0.248 (6.30)
1
2
3
PIN 2
PIN 1
PIN 3
0.077 (1.96)
0.069 (1.76)
0.028 (0.71)
0.016 (0.41)
0.216 (5.48)
0.208 (5.28)
0.028 (0.71)
0.016 (0.41)
0.124 (3.15)
0.112 (2.85)
0.014 (0.35)
0.010 (0.25)
0.145 (3.69)
0.133 (3.39)
0.037 (0.95)
0.033 (0.85)
0.037 (0.95)
0.033 (0.85)
0.069 (1.74)
0.057 (1.44)
0.049 (1.25)
0.037 (0.95)
Dimensions in inches and (millimeters)
■ Maximum ratings and electrical characteristics
Rating at 25OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Parameter
Marking code
Peak repetitive reverse voltage
Working peak reverse voltage
DC blocking voltage
Forward rectified current
Forward surge current
Peak repetitive reverse surge current
Thermal resistance(1)
Operating and Storage temperature
Conditions
Symbol
8.3ms single half sine-wave superimposed on
rate load (JEDEC method)
2us - 1kHz
Junction to case
VRRM
VRWM
VRM
IO
IFSM
IRRM
RθJC
TJ, TSTG
CSP12S120S
CSP12S120S
120
12
250
3
6
-55 ~ +150
UNIT
V
A
A
A
OC/W
OC
Parameter
Conditions
Forward voltage drop
IF = 12A, TJ = 25OC
IF = 12A, TJ = 125OC
Reverse current
VR = VRRM TJ = 25OC
VR = VRRM TJ = 125OC
Note : 1.Device mounted on Polymide PCB with 16x recommended pad layout.
Symbol MIN.
VF
IR
TYP.
630
2
MAX.
800
680
0.25
35
UNIT
mV
mA
Document ID : DS-12K5X
1
Revised Date : 2015/09/15
Revision : C2