CD10L100S Datasheet, PDF (1/3 Pages) Chip Integration Technology Corporation – 10A Surface Mount Trench Schottky Rectifier

CD10L100S
10A Surface Mount Trench Schottky Rectifier
■ Features
• Low forward voltage drop.
• Excellent high temperature stability.
• Fast switching capability.
• Suffix "G" indicates Halogen-free part, ex.CD10L100SG.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
■ Mechanical data
• Epoxy : UL94-V0 rated flame retardant.
• Case : Molded plastic, DPAK / TO-252.
• Lead : Solder plated, solderable per MIL-STD-750,
Method 2026.
• Polarity: Indicated by cathode band.
• Mounting Position : Any.
• Weight : Approximated 0.34 gram.
■ Outline
DPAK(TO-252)
0.059(1.50)
0.047(1.20)
0.262(6.65)
0.250(6.35)
0.212(5.40)
0.205(5.20)
2
Marking code
0.094(2.40)
0.087(2.20)
0.022(0.56)
0.018(0.46)
1
0.027(0.70)
0.020(0.50)
3
0.022(0.56)
0.018(0.46)
0.185(4.70)
0.177(4.50)
PIN 1
PIN 3
0.057(1.45)
0.037(0.95)
PIN 2
Dimensions in inches and (millimeters)
■ Maximum ratings and electrical characteristics
Rating at 25^OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Parameter
Marking code
Peak repetitive reverse voltage
Working peak reverse voltage
DC blocking voltage
RMS reverse voltage
Forward rectified current
Forward surge current
Thermal resistance(1)
Operating and Storage temperature
Conditions
Symbol
8.3ms single half sine-wave superimposed on
rate load (JEDEC method)
Junction to case
V_RRM
V_RWM
V_RM
V_R(RMS)
I_O
I_FSM
R_θJC
T_J, T_STG
CD10L100S
CD10L100S
100
70
10
200
3.0
-55 ~ +150
UNIT
V
V
A
A
O_C/W
O_C
Parameter
Conditions
Forward voltage drop
Reverse current
I_F = 2A, T_J = 25^OC
I_F = 2A, T_J = 125^OC
I_F = 5A, T_J = 25^OC
I_F = 10A, T_J = 25^OC
I_F = 10A, T_J = 125^OC
V_R = V_RRM T_J = 25^OC
V_R = V_RRM T_J = 125^OC
Note : 1.Thermal resistance from junction to case per leg, with heatsink size(1.35" x 0.95" x 0.18") Al-plate.
2.Device mounted on FR-4 substrate PC board, 1oz copper with minimum recommended pad layout.
3.Device mounted on Polymide substate, 1*MRP, 2oz, copper, PC boards.
1
Symbol MIN.
V_F
I_R
TYP.
460
370
550
690
620
MAX.
490
400
580
750
650
0.2
20
UNIT
mV
mA
Document ID : DS-12KGB
Revised Date : 2015/01/26
Revision : C