CB230WSG-ST Datasheet, PDF (1/4 Pages) Chip Integration Technology Corporation – 2A Trench Schottky Rectifier

Chip Integration Technology Corporation
CB230WSG-ST
2A Trench Schottky Rectifier
Main Product Characteristics
I_F(AV)
V_RRM
T_J
V_F(Typ)
2A
30V
125 ^OC
0.36V
■ Features
• Ultra small surface mount package.
• Low forward voltage drop.
• Lead free in compliance with EU RoHS.
■ Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-323ST
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
• Weight : Approximated 0.008 gram
■Outline
SOD-323ST
0.039(0.98)
0.031(0.78)
0.106(2.7)
0.091(2.3)
0.055(1.4)
0.047(1.2)
0.008(0.20)Max.
0.059(1.5)
0.043(1.1)
0.029(0.73)
0.025(0.63)
0.030 (0.75)
0.022 (0.55)
0.051(1.3)
0.035(0.9)
0.039(1.0)
0.022(0.55)
0.003(0.08)Max.
0.091(2.3)
0.083(2.1)
Dimensions in inches and (millimeters)
■Circuit Diagram
■ Maximum ratings and electrical characteristics
Rating at 25^OC ambient temperature unless otherwise specified.
Parameter
Working peak reverse voltage
Forward rectified current
Forward surge current
Peak repetitive reverse surge current
Typical Thermal resistance
Storage temperature
Operating Junction temperature
Conditions
Symbol
8.3ms single half sine-wave superimposed on
rate load (JEDEC method)
V_RWM
I_O
I_FSM
2us - 1kHz
I_RRM
Junction to ambient
R_θJA
T_STG
T_J
CB230WSG-ST
30
2
25
2
700
-55 ~ +150
-55 ~ +125
UNIT
V
A
A
A
O_C/W
O_C
O_C
Parameter
Forward voltage drop
Reverse current
Reverse Breakdown Voltage
Conditions
I_F = 1A, T_J = 25^OC
I_F = 2A, T_J = 25^OC
I_F = 2A, T_J = 125^OC
V_R = 5V T_J = 25^OC
V_R = 30V T_J = 25^OC
V_R = 30V T_J = 125^OC
I_R = 0.5mA, T_J = 25^OC
Symbol MIN.
V_F
I_R
V_BR
30
TYP.
390
425
360
0.01
0.02
5
MAX.
440
500
380
0.08
0.1
30
UNIT
mV
mA
V
Document ID : DS-11K039
Revised Date : 2017/07/18
1
Revision : C