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BAT42W Datasheet, PDF (1/3 Pages) Pan Jit International Inc. – SURFACE MOUNT SCHOTTKY BARRIER DIODES
BAT42W / BAT43W
200mA Surface Mount Small Signal Diodes
■ Features
■ Outline
• Low profile surface mounted application in order to
optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Suffix "G" indicates Halogen-free part, ex.BAT42WG.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
SOD-123
0.110 (2.80 )
0.10 2 (2.60 )
Marking code
■ Mechanical data
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123
• Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Weight : 0.0004 ounce, 0.010 gram
0.15 2 (3.85 )
0.14 0 (3.55 )
0.04 9 (1.25 )
0.04 1 (1.05 )
■ Maximum ratings and electrical characteristics
Dimensions in inches and (millimeters)
Rating at 25OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Parameter
Conditions
Symbol BAT42W
BAT43W
Marking code
S7
S8
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
RMS Reverse Voltaget
Average Rectified Output Current
Non-repetitive Peak Forward Surge Current @ t < 1.0s
Total Device Dissipation
Thermal Resistance Junction To Ambient junction to ambientrse
Operating Temperature
Storage Temperature
Reverse Breakdown Voltage
Forward Voltage
Reverse Current
Junction Capacitance
Reverse Recover time
IF = 200mA
BAT42W, BAT43W
IF = 10mA
BAT42W
IF = 50mA
BAT42W
IF = 2.0mA
BAT43W
IF = 15mA
BAT43W
VR = 25 V
VR = 25 V, TJ = 100OC
VR = 0 V, f = 1.0MHz
IF = IR = 200mAdc, Irr = 0.1 X IR, RL = 100Ω
VRRM
VRWM
VR
VR(RMS)
I FAV
IFSM
PD
RθJA
TJ
TSTG
V(BR)R
VF
IR
CT
trr
30
21
200
4.0
200
500
-55 ~ +125
-55 ~ +125
30
1.0
0.4
0.65
0.26
0.33
0.45
0.5
100
10
5.0
UNIT
V
V
mA
A
mW
OC/W
OC
OC
V
V
uA
pF
ns
Document ID : DS-22K0F
1
Issued Date : 2010/05/05
Revised Date : 2012/05/31
Revision : C