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B220LW-ST Datasheet, PDF (1/3 Pages) Chip Integration Technology Corporation – 2A Surface Mount Schottky Barrier Rectifiers | |||
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B220LW-ST THRU B240LW-ST
2A Surface Mount Schottky Barrier Rectifiers
â Features
⢠Low profile surface mounted application in order to
optimize board space.
⢠Low power loss, high efficiency.
⢠High current capability, low forward voltage drop.
⢠Ultra high-speed switching.
⢠Silicon epitaxial planar chip, metal silicon junction.
⢠Suffix "G" indicates Halogen-free part, ex.B220LWG-ST.
⢠Lead-free parts meet environmental standards of
MIL-STD-19500 /228
â Mechanical data
⢠Epoxy:UL94-V0 rated flame retardant
⢠Case : Molded plastic, SOD-123ST
⢠Terminals : Solder plated, solderable per
MIL-STD-750, Method 2026
⢠Polarity : Indicated by cathode band
⢠Weight : Approximated 0.0155 gram
â Outline
SOD-123ST
0.039(1.0)
0.031(0.8)
0.154(3.9)
0.138(3.5)
0.016(0.4) Typ.
0.079(2.0)
0.063(1.6)
0.008(0.20)Max.
0.096(2.45)
0.081(2.05)
0.055(1.4)
0.039(1.0)
0.039 (1.0)
0.024 (0.6)
0.051(1.3)
0.035(0.9)
0.039(1.0)
0.031(0.8)
0.057(1.45)
0.041(1.05)
Dimensions in inches and (millimeters)
â Maximum ratings and electrical characteristics
Rating at 25OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Parameter
Forward rectified current
Forward surge current
Reverse current
Diode junction capacitance
Thermal resistance
Storage temperature
Conditions
Symbol
IO
8.3ms single half sine-wave superimposed on
rate load (JEDEC method)
IFSM
VR = VRRM TA = 25OC
IR
VR = VRRM TA = 100OC
f=1MHz and applied 4V DC reverse voltage
CJ
Junction to ambient
RθJA
TSTG
MIN.
-55
TYP.
160
70
MAX.
2.0
50
1.0
20
+150
UNIT
A
A
mA
pF
OC/W
OC
Symbol
Max.
repetitive peak
Marking code
reverse voltage
VRRM (V)
B220LW-ST
L22
20
B240LW-ST
L24
40
Max.
RMS voltage
VRMS (V)
14
28
Max. DC
blocking voltage
VR (V)
20
40
Max. forward voltage
@2A, TA = 25OC
VF (V)
0.38
0.40
Operating temperature
TJ (OC)
-55 ~ +100
Document ID : DS-12K4E
1
Issued Date : 2010/05/05
Revised Date : 2012/05/31
Revision : C
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