CS4121 Datasheet, PDF (8/8 Pages) Cherry Semiconductor Corporation – Low Voltage Precision Air-Core Low Voltage Precision Air-Core

Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
Lead Count
16L PDIP*
20L SOIC*
D
Metric
English
Max Min Max Min
19.69 18.67 .775 .735
13.00 12.60 .512 .496
PACKAGE THERMAL DATA
Thermal Data
R_QJC
typ
R_QJA
typ
16L PDIP*
15
50
20L SOIC*
9
55
*Internally Fused Leads
Plastic DIP (N); 300 mil wide
ûC/W
ûC/W
7.11 (.280)
6.10 (.240)
3.68 (.145)
2.92 (.115)
8.26 (.325)
7.62 (.300)
1.77 (.070)
1.14 (.045)
2.54 (.100) BSC
.356 (.014)
.203 (.008)
REF: JEDEC MS-001
0.39 (.015)
MIN.
.558 (.022)
.356 (.014)
D
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
All specs are the same.
Surface Mount Wide Body (DW); 300 mil wide
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
0.51 (.020)
0.33 (.013)
2.49 (.098)
2.24 (.088)
1.27 (.050) BSC
2.65 (.104)
2.35 (.093)
1.27 (.050) 0.32 (.013)
0.40 (.016) 0.23 (.009)
REF: JEDEC MS-013
Ordering Information
Part Number
CS4121ENF16
CS4121EDWF20
CS4121EDWFR20
Description
16L PDIP (internally fused leads)
20L SOIC (internally fused leads)
20L SOIC (internally fused leads)
(tape & reel)
Rev. 12/4/96
0.30 (.012)
D
0.10 (.004)
Cherry Semiconductor Corporation reserves the
right to make changes to the specifications without
notice. Please contact Cherry Semiconductor
Corporation for the latest available information.
8
© 1999 Cherry Semiconductor Corporation