CS4172 Datasheet, PDF (6/6 Pages) Cherry Semiconductor Corporation – Single Air-Core Gauge Driver

Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
Lead Count
16 Lead PDIP
16 Lead SO Wide*
D
Metric
English
Max Min Max Min
19.69 18.67 .775 .735
10.50 10.10 .413 .398
Thermal
Data
R_QJC typ
R_QJA typ
Plastic DIP (N); 300 mil wide
PACKAGE THERMAL DATA
16 Lead
PDIP
42
80
16 Lead
SO Wide*
18
75
ûC/W
ûC/W
7.11 (.280)
6.10 (.240)
3.68 (.145)
2.92 (.115)
8.26 (.325)
7.62 (.300)
1.77 (.070)
1.14 (.045)
2.54 (.100) BSC
.356 (.014)
.203 (.008)
REF: JEDEC MS-001
0.39 (.015)
MIN.
.558 (.022)
.356 (.014)
D
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
All specs are the same.
Surface Mount Wide Body (DW); 300 mil wide
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
0.51 (.020)
0.33 (.013)
2.49 (.098)
2.24 (.088)
1.27 (.050) BSC
2.65 (.104)
2.35 (.093)
1.27 (.050) 0.32 (.013)
0.40 (.016) 0.23 (.009)
REF: JEDEC MS-013
Ordering Information
Part Number
CS4172XN16
CS4172XDWF16
CS4172XDWFR16
Description
16 Lead PDIP
16 Lead SO Wide*
16 Lead SO Wide* (tape & reel)
*Internally Fused Leads
Rev. 4/19/99
0.30 (.012)
D
0.10 (.004)
Cherry Semiconductor Corporation reserves the right to
make changes to the specifications without notice. Please
contact Cherry Semiconductor Corporation for the latest
available information.
6
© 1999 Cherry Semiconductor Corporation