CS2516 Datasheet, PDF (6/6 Pages) Cherry Semiconductor Corporation – Pulse-Load Battery Monitor

Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
Lead Count
8L PDIP
8L SOIC
Metric
Max Min
10.16 9.02
5.00 4.80
D
English
Max Min
.400 .355
.197 .189
Thermal Data
RQ_JC
typ
RQ_JA
typ
8L PDIP
52
100
8L SO
45
165
Surface Mount Narrow Body (D); 150 mil wide
ûC/W
ûC/W
4.00 (.157)
3.80 (.150)
6.20 (.244)
5.80 (.228)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
1.27 (.050)
0.40 (.016)
0.25 (.010)
0.19 (.008)
1.57 (.062)
1.37 (.054)
REF: JEDEC MS-012
1.75 (.069) MAX
0.25 (0.10)
0.10 (.004)
D
Plastic DIP (N); 300 mil wide
7.11 (.280)
6.10 (.240)
3.68 (.145)
2.92 (.115)
8.26 (.325)
7.62 (.300)
1.77 (.070)
1.14 (.045)
2.54 (.100) BSC
.356 (.014)
.203 (.008)
REF: JEDEC MS-001
0.39 (.015)
MIN.
.558 (.022)
.356 (.014)
D
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
All specs are the same.
Ordering Information
Part Number
CS2516KN8
CS2516KD8
CS2516KDR8
Description
8 Lead PDIP
8 Lead SOIC
8 Lead SOIC (tape & reel)
Rev. 1/17/95
Cherry Semiconductor Corporation reserves the
right to make changes to the specifications without
notice. Please contact Cherry Semiconductor
Corporation for the latest available information.
6
© 1999 Cherry Semiconductor Corporation