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MBRF1620CT Datasheet, PDF (1/2 Pages) Microdiode Electronics (Jiangsu) Co.,Ltd. – SCHOTTKY BARRIER RECTIFIER
MBRF1620CT THRU MBRF16100CT
SCHOTTKY BARRIER RECTIFIER
Reverse Voltage - 20 to 100 Volts Forward Current - 16.0 Amperes
ITO-220AB
10.2± 0.2
4.5± 0.2
3.1+-00..12
PIN
1 23
4.0± 0.3
1.4± 0.1
0.6± 0.1
2.6± 0.2
2.6± 0.15
PIN 1
PIN 3
PIN 2
CASE
0.6± 0.1
Dimensions in inches and (millimeters)
FEATURES
High surge capacity.
For use in low voltage, high frequency inverters,free
wheeling,and polarity protection applications.
Metal silicon junction,majority carrier conduction.
High current capability,low forward voltage drop.
Guard ring for over voltage protection.
MECHANICAL DATA
Case: ITO-220AB molded plastic body
Terminals: Leads solderable per MIL-STD-750,
Method 2026
Polarity: As marked
Mounting Position: Any
Weight:0.060 ounce, 1.67 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
MDD Catalog Number
SYMBOLS
MBRF
1620CT
MBRF MBRF MBRF MBRF MBRF MBRF MBRF MBRF MBRF
1630CT 1640CT 1645CT 1650CT 1660CT 1670CT 1680CT 1690CT 16100CT
UNITS
Maximum repetitive peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
(see fig.1)
VRRM
VRMS
VDC
I(AV)
20 30 40 45 50 60 70 80 90 100 VOLTS
14 21 28 32 35 42 49 56 63 70 VOLTS
20 30 40 45 50 60 70 80 90 100 VOLTS
16.0
Amps
Peak forward surge current
8.3ms single half sine-wave superimposed on
IFSM
rated load (JEDEC Method)
Maximum instantaneous forward voltage at 8.0A VF
0.55
Maximum DC reverse current TA=25 C
at rated DC blocking voltage TA=100 C
IR
15.0
150.0
0.75
1.0
0.85
50.0
Amps
Volts
mA
Typical junction capacitance (NOTE 1)
CJ
500
360
pF
Typical thermal resistance (NOTE 2)
RθJC
2.0
C/W
Operating junction temperature range
TJ
-55 to +125
-55 to +150
C
Storage temperature range
TSTG
-55 to +150
C
Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
2.Thermal resistance from junction to case