DLFR101 Datasheet, PDF (1/2 Pages) Microdiode Electronics (Jiangsu) Co.,Ltd. – SURFACE MOUNT RECTIFIERS

DLFR101 THRU DLFR107
SURFACE MOUNT RECTIFIERS
VOLTAGE RANGE : 50 --- 1000 V CURRENT: 1.0 A
DO - 213AB
SOLDERABLE ENDS
D2=D1
Đ0
Ē0.20
D2
0.5± 0.1
4.9± 0.2
0.5± 0.1
Dimensions in millimeters
FEATURES
Plastic package has underwriters laboratories
flammability classification 94V-0
Glass passivated chip junction
For surface mount applications
High temperature metallurgically bonded construction
Cavity-free glass passivated junction
High temperature soldering guaranteed:450 /5 seconds
at terminals.Complete device sub-mersible temperature
of 265 for 10 seconds in solder bath
MECHANICAL DATA
Case: JEDEC DO-213AB,molded plastic
Terminals: Axial lead ,solderable per
MIL- STD-750,Method 2026
Polarity: Color band denotes cathode
Weight: 0.0046 ounces, 0.116 grams
Mounting position: Any
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 ambient temperature unless otherwise specified.
Single phase,half wave,60 Hz,resistive or inductive load. For capacitive load,derate current by 20%.
MDD CatalogNumber
Maximum recurrent peak reverse voltage
Maximum RMS voltage
Maximum DC blocking voltage
Maximum average forward rectified current
T_T=55
Peak forward surge current
8.3ms single half-sine-wave
superimposed on rated load (JEDEC Method)
V_RRM
V_RMS
V_DC
I_(AV)
DL
FR101
50
35
50
DL DL DL DL DL DL
FR102 FR103 FR104 FR105 FR106 FR107
100 200 400 600 800 ₁₀₀₀
70 140 280 420 560 700
100 200 400 600 800 ₁₀₀₀
UNITS
V
V
V
1.0
A
I_FSM
30
A
Maximum instantaneous forward voltage @1.0A
V_F
1.3
V
Maximum reverse current
@T_A=25
at rated DC blocking voltage @T_A=125
Maximum reverse recovery time (Note 1)
Typical junction capacitance (Note 2)
Typical thermal resistance (Note 3)
Operating junction temperature range
Storage temperature range
NOTE: 1. Measured with I_F=0.5A,I_R=1.0A,I_rr=0.25A
I_R
t_rr
C_j
R_θJA
T_j
T_STG
5.0
µA
50
150
250
500
ns
15
pF
75
/W
- 55 ---- +175
- 55 ---- +175
2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
3. Thermal resistance from junction to ambient, 0.24×0.24"(6.0×6.0mm) copper pads to each terminal.