BZT52C2V4 Datasheet, PDF (1/4 Pages) Diodes Incorporated – SURFACE MOUNT ZENER DIODE

BZT52C2V0 - BZT52C51
Surface mount zener diode
FEATURES
z Planar die construction.
z 500mW power dissipation on ceramic
PCB.
z General purpose, medium current.
z Ideally suited for automated assembly processes.
Pb
Lead-free
APPLICATIONS
z Zener diode.
z Ultra-small surface mount package.
ORDERING INFORMATION
SOD-123
Type No.
Marking
Package Code
BZT52C2V4-BZT52C51
See table 2
SOD-123
MAXIMUM RATING @ Ta=25℃ unless otherwise specified
Characteristic
Symbol
Value
Unit
Forward Voltage
@ I_F=10mA
V_F
0.9
V
Power Dissipation
P_d
500
Thermal resistance,junction to ambient air
R_θjA
305
mW
℃/W
Junction temperature
T_j
150
℃
Storage temperature range
T_stg
-65-150
℃
Notes: 1. Device mounted on ceramic PCB; 7.6mm x 9.4mm x 0.87mm with pad areas 25mm²
2. Short duration test pulse used to minimize self-heating effect.
3. When provided, otherwise, parts are provided with date code only, and type number
identifications appears on reel only.
4. f = 1KHz
MDD ELECTRONIC
201207