SMCPD Datasheet, PDF (3/3 Pages) Central Semiconductor Corp – SMC Case

Material Composition Specification
SMC Case
Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232.5 mg
Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10%
Component
Material
Material
Substance
Substance CAS No.
(%wt) (mg)
(%wt) (mg) (ppm)
active device
doped Si
1.63% 3.8
Si
7440-21-3 1.63% 3.8 16,344
leadframe
copper
39.11% 90.92
Cu
7440-50-8 39.11% 90.92 391,054
die attach
high temperature
solder paste
1.88%
4.36
Pb
7439-92-1 1.73% 4.033 17,346
Sn
7440-31-5 0.09% 0.218 938
Ag
7440-22-4 0.05% 0.109 469
silica
7631-86-9 38.61% 89.76 386,065
epoxy resin 29690-82-2 11.35% 26.4 113,548
EMC
56.77% 132 phenol resin 9003-35-4 5.68% 13.2 56,774
encapsulation*
Sb2O3
Br
1309-64-4 0.57% 1.32
7726-95-6 0.57% 1.32
5,677
5,677
silica (fused) 60676-86-0 43.72% 101.64 437,161
epoxy resin 29690-82-2 5.68% 13.2 56,774
EMC GREEN 56.77% 132 phenol resin 9003-35-4 5.51% 12.804 55,071
plating**
tin/lead process 0.61%
carbon black 1333-86-4
metal
hydroxide
1309-42-8
Sn
7440-31-5
1.42
Pb
7439-92-1
0.17%
1.7%
0.49%
0.12%
0.396
3.96
1.136
0.284
1,703
17,032
4,886
1,222
matte tin
0.61% 1.42
Sn
7440-31-5 0.61% 1.42
*EMC GREEN molding compound is Halogen-Free.
**For Lead Free plating, add suffix “LEAD FREE” to part number.
For Tin/Lead plating, add suffix “TIN/LEAD” to part number.
No suffix designation allows for the supply of either lead-free or tin/lead plated product depending on availability.
6,108
Disclaimer
The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no
guarantee to completeness or accuracy, as some information is derived from data sources outside the company.
w w w. c e n t r a l s e m i . c o m
R5 (3-June 2011)