D2PAKPD Datasheet, PDF (3/3 Pages) Central Semiconductor Corp – D2PAK Case

Material Composition Specification
D²PAK Case
Device average mass . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1460 mg
Fluctuation margin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-10%
Component
Material
Material
Substance
Substance CAS No.
(%wt) (mg)
(%wt) (mg) (ppm)
active device
doped Si
0.44% 6.42
Si
7440-21-3 0.44% 6.42 4,397
leadframe
Cu alloy
64.56% 943
Cu
7440-50-8 64.52% 942 645,224
Fe
7439-89-6 0.03% 0.5
342
die attach
high temperature
solder paste
1.13%
16.5
Pb
7439-92-1 1.04% 15.25 10,446
Sn
7440-31-5 0.06% 0.825 565
Ag
7440-22-4 0.03% 0.412 282
silica
7631-86-9 21.75% 317.5 217,472
epoxy resin 29690-82-2 6.4% 93.4 63,974
EMC
31.98% 467 phenol resin 9003-35-4 3.2% 46.67 31,967
encapsulation*
Sb2O3
Br
1309-64-4 0.32% 4.67
7726-95-6 0.32% 4.67
3,199
3,199
silica (fused) 60676-86-0 24.62% 359.5 246,240
epoxy resin 29690-82-2 3.2% 46.73 32,008
EMC GREEN 31.98% 467 phenol resin 9003-35-4 3.1% 45.28 31,015
plating**
tin/lead process 1.89%
carbon black 1333-86-4
metal
hydroxide
1309-42-8
Sn
7440-31-5
27.6
Pb
7439-92-1
0.1%
0.96%
1.7%
0.19%
1.4
14.0
24.88
2.76
959
9,589
17,042
1,890
matte tin
1.89% 27.6
Sn
7440-31-5 1.89% 27.64
*EMC GREEN molding compound is Halogen-Free.
**For Lead Free plating, add suffix “LEAD FREE” to part number.
For Tin/Lead plating, add suffix “TIN/LEAD” to part number.
No suffix designation allows for the supply of either lead-free or tin/lead plated product depending on availability.
18,932
Disclaimer
The information provided in this Material Composition data sheet is, to the best of our knowledge, correct. However, there is no
guarantee to completeness or accuracy, as some information is derived from data sources outside the company.
w w w. c e n t r a l s e m i . c o m
R2 (3-June 2011)