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CTLSH3-30M833 Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – SURFACE MOUNT LOW VF SILICON SCHOTTKY RECTIFIER TINY LEADLESS MODULE
CTLSH3-30M833
SURFACE MOUNT
LOW VF
SILICON
SCHOTTKY RECTIFIER
TINY LEADLESS MODULETM
Top View
Bottom View
TLM833 CASE
MARKING CODE: CHA1
CentralTM
Semiconductor Corp.
DESCRIPTION:
The CENTRAL SEMICONDUCTOR CTLSH3-30M833 is
a high performance 3.0 Amp Schottky Rectifier designed
for applications where small size and operational
efficiency are prime requirements. With a maximum
power dissipation of 4.5W, this leadless package design
has a watts per unit area at least twice that of equivalent
packaged devices.
FEATURES:
• High Current (IF=3.0A)
• Low Leakage/Low VF
• High Thermal Efficiency
• 3 x 3mm TLM™ case
MAXIMUM RATINGS: (TA=25°C)
Continuous Reverse Voltage
Average Forward Current
Peak Forward Surge Current (8.3ms)
Power Dissipation
Power Dissipation
Power Dissipation
Operating and Storage
Junction Temperature
Thermal Resistance
Thermal Resistance
Thermal Resistance
SYMBOL
VR
IO
IFSM
PD
PD
PD
TJ, Tstg
ΘJA
ΘJA
ΘJA
30
3.0
25
4.5
4.0
2.5
-65 to +150
27.78
31.25
50.00
ELECTRICAL CHARACTERISTICS PER DIODE: (TA=25°C unless otherwise noted)
SYMBOL TEST CONDITIONS
MIN
IR
VR=30V
BVR
IR=5.0mA
30
VF
IF=500mA
VF
IF=1.0A
VF
IF=2.0A
VF
IF=3.0A
MAX
1.0
0.30
0.35
0.40
0.45
UNITS
V
A
A
W (Note 1)
W (Note 2)
W (Note 3)
°C
°C/W (Note 1)
°C/W (Note 2)
°C/W (Note 3)
UNITS
mA
V
V
V
V
V
Notes: (1) Ceramic or aluminum core PC Board with copper mounting pad area of 75 mm2
(2) FR-4 Epoxy PC Board with copper mounting pad area of 75 mm2
(3) FR-4 Epoxy PC Board with copper mounting pad area of 25 mm2
R4 (03-April 2006)