CPZ33R Datasheet, PDF (1/2 Pages) Central Semiconductor Corp – 12 Volt Quad TVS Chip

PROCESS CPZ33R
Transient Voltage Suppressor
12 Volt Quad TVS Chip
PROCESS DETAILS
Die Size
Die Thickness
Cathode Bonding Pad Areas (4)
Top Side Metalization
Back Side Metalization
14.2 x 14.2 MILS
3.9 MILS
4.7 MILS DIAMETER EACH
Al - 13,000Å
Au - 12,000Å
GEOMETRY
GROSS DIE PER 5 INCH WAFER
84,926
PRINCIPAL DEVICE TYPE
CMNTVS12V
w w w. c e n t r a l s e m i . c o m
R0 (3-January 2012)